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MIC45208-1YMP-T1 - Microchip

Description: Module DC-DC 1-OUT 0.8V to 5.5V 10A 52-Pin B2QFN T/R

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MIC45208-1YMP-T1 - Microchip PCB footprint - Other - Other - MIC45208-1YMP-T1-5
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MIC45208-1YMP-T1 - Microchip  - 3D model - Other - MIC45208-1YMP-T1-5
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MIC45208-1YMP-T1 Details

  • Manufacturer Part Number:

    MIC45208-1YMP-T1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    52

  • Manufacturer Package Code:

    B2QFN-52

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    6 Weeks

  • Date Of Intro:

    2017-11-10

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    26 V

  • Input Voltage-Min:

    4.5 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    S-XQMA-N52

  • JESD-609 Code:

    e3

  • Length:

    10 mm

  • Number of Functions:

    1

  • Number of Terminals:

    52

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    10 A

  • Output Voltage-Max:

    22.1 V

  • Output Voltage-Min:

    0.8 V

  • Output Voltage-Nom:

    3.3 V

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    QMA

  • Package Shape:

    SQUARE

  • Package Style:

    MICROELECTRONIC ASSEMBLY

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    4 mm

  • Supply Voltage-Nom (Vsup):

    12 V

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    750 kHz

  • Technology:

    HYBRID

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    10 mm

MIC45208-1YMP-T1 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the MIC45208-1YMP-T1 near a thermal pad or a heat sink, and ensuring good airflow around the device. The datasheet provides some guidelines, but a more detailed application note from Microchip provides additional recommendations.
  • To ensure reliable operation over the full temperature range, it's essential to follow the recommended operating conditions, including voltage and current limits. Additionally, consider using thermal management techniques, such as heat sinks or thermal interfaces, to keep the device within its specified temperature range.
  • When using the MIC45208-1YMP-T1 in a high-reliability application, it's crucial to consider the device's failure modes, such as thermal shutdown and overcurrent protection. Implementing redundant systems, error detection, and correction mechanisms can help ensure the overall system's reliability.
  • To troubleshoot issues with the MIC45208-1YMP-T1, start by reviewing the device's operating conditions, including voltage, current, and temperature. Check for signs of physical damage, such as cracks or corrosion, and verify that the device is properly soldered. Use oscilloscopes or logic analyzers to monitor the device's signals and identify potential issues.
  • Yes, the MIC45208-1YMP-T1, like any switching regulator, can generate electromagnetic interference (EMI). To minimize EMI, use proper PCB layout techniques, such as separating analog and digital grounds, and using shielding or filtering components. Additionally, ensure that the device is properly decoupled and that the input and output capacitors are properly selected.

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MIC45208-1YMP-T1 Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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