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MIC5013YM-TR - Microchip

Description: MICROCHIP - MIC5013YM-TR - MOSFET DRIVER, HIGH/LOW SIDE, SOIC-8

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MIC5013YM-TR - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 8-Lead SOIC (M)
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MIC5013YM-TR - Microchip  - 3D model - Small Outline Packages - 8-Lead SOIC (M)
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MIC5013YM-TR Details

  • Manufacturer Part Number:

    MIC5013YM-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LEAD FREE, SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOIC-8

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • High Side Driver:

    YES

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    BUFFER OR INVERTER BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.879 mm

  • Supply Current-Max:

    20 mA

  • Supply Voltage-Max:

    32 V

  • Supply Voltage-Min:

    7 V

  • Supply Voltage-Nom:

    15 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    10 µs

  • Turn-on Time:

    200 µs

  • Width:

    3.9 mm

MIC5013YM-TR Frequently Asked Questions (FAQs)

  • A good PCB layout for MIC5013YM-TR involves keeping the input and output traces separate, using a solid ground plane, and placing the input and output capacitors close to the device. Additionally, it's recommended to use a shielded inductor and keep the switching node (pin 5) away from sensitive analog circuits.
  • To ensure the MIC5013YM-TR operates within its safe operating area (SOA), monitor the device's junction temperature, input voltage, and output current. Ensure the device is not subjected to excessive voltage or current stress, and provide adequate heat sinking to prevent overheating.
  • When selecting input and output capacitors for MIC5013YM-TR, consider the capacitor's equivalent series resistance (ESR), capacitance value, and voltage rating. Choose capacitors with low ESR, sufficient capacitance to filter out ripple, and a voltage rating that exceeds the maximum input voltage.
  • To troubleshoot issues with the MIC5013YM-TR, start by verifying the PCB layout and component selection. Check for proper decoupling, correct component values, and adequate heat sinking. Use an oscilloscope to monitor the input and output waveforms, and check for signs of oscillation or instability. Consult the datasheet and application notes for guidance on troubleshooting and optimization.
  • For thermal management, ensure the MIC5013YM-TR is mounted on a PCB with a solid ground plane, and provide adequate heat sinking using a heat sink or thermal pad. Keep the device away from other heat sources, and consider using a thermal interface material to improve heat transfer.

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MIC5013YM-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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