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MIC5020YM - Microchip

Description: MICROCHIP - MIC5020YM - IC, DRIVER, MOSFET, LOW SIDE

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PCB Footprints
MIC5020YM - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 8-Lead SOIC (M)
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MIC5020YM - Microchip  - 3D model - Small Outline Packages - 8-Lead SOIC (M)
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MIC5020YM Details

  • Manufacturer Part Number:

    MIC5020YM

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOIC-8

  • Country Of Origin:

    Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • High Side Driver:

    NO

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    BUFFER OR INVERTER BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.879 mm

  • Supply Current-Max:

    25 mA

  • Supply Voltage-Max:

    50 V

  • Supply Voltage-Min:

    11 V

  • Supply Voltage-Nom:

    12 V

  • Supply Voltage1-Max:

    50 V

  • Supply Voltage1-Min:

    11 V

  • Supply Voltage1-Nom:

    12 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    1.5 µs

  • Turn-on Time:

    0.8 µs

  • Width:

    3.9 mm

MIC5020YM Frequently Asked Questions (FAQs)

  • A good PCB layout for MIC5020YM involves keeping the input and output capacitors close to the IC, using a solid ground plane, and minimizing the length of the input and output traces. Additionally, it's recommended to use a shielded inductor and to keep the switching node (SW) away from sensitive analog circuits.
  • To ensure the MIC5020YM operates within the recommended junction temperature range, it's essential to provide adequate heat sinking, such as using a thermal pad or a heat sink, and to keep the ambient temperature within the recommended range. Additionally, reducing the input voltage and output current can also help reduce the junction temperature.
  • The recommended input capacitor type for MIC5020YM is a low-ESR ceramic capacitor, such as X5R or X7R, with a value of 10uF to 22uF. The capacitor should be placed as close to the VIN pin as possible to minimize the inductance of the input traces.
  • To optimize the MIC5020YM for low standby power consumption, it's recommended to use a low-quiescent-current (Iq) regulator, such as the MIC5020YM-30YM, and to ensure that the input voltage is as low as possible while still meeting the required output voltage. Additionally, using a low-leakage inductor and minimizing the output capacitance can also help reduce standby power consumption.
  • The recommended output capacitor type for MIC5020YM is a low-ESR ceramic capacitor, such as X5R or X7R, with a value of 10uF to 22uF. The capacitor should be placed as close to the VOUT pin as possible to minimize the inductance of the output traces.

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MIC5020YM Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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