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MIC5303-1.8YMT-TR - Microchip

Description: LDO Regulator Pos 1.8V 0.3A 4-Pin TDFN EP T/R

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MIC5303-1.8YMT-TR - Microchip - PCB symbol
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PCB Footprints
MIC5303-1.8YMT-TR - Microchip PCB footprint - Small Outline No-lead - Small Outline No-lead - MIC5337-2.8YMT-TR
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MIC5303-1.8YMT-TR - Microchip - 3D model - Small Outline No-lead - MIC5337-2.8YMT-TR
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MIC5303-1.8YMT-TR Details

  • Manufacturer Part Number:

    MIC5303-1.8YMT-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    1.20 X 1.60 MM, ROHS COMPLIANT, MLF-4

  • Pin Count:

    4

  • Manufacturer Package Code:

    UDFN-4

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    23

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.2 V

  • Dropout Voltage1-Nom:

    0.1 V

  • Input Voltage Absolute-Max:

    6 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2.3 V

  • JESD-30 Code:

    R-PDSO-N4

  • JESD-609 Code:

    e4

  • Length:

    1.6 mm

  • Line Regulation-Max:

    0.03456%

  • Load Regulation-Max:

    0.036%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    4

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.3 A

  • Output Voltage1-Max:

    1.854 V

  • Output Voltage1-Min:

    1.746 V

  • Output Voltage1-Nom:

    1.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC4,.05,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    0.6 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Voltage Tolerance-Max:

    3%

  • Width:

    1.2 mm

MIC5303-1.8YMT-TR Frequently Asked Questions (FAQs)

  • The MIC5303-1.8YMT-TR can handle input voltages up to 6V, but it's recommended to keep the input voltage within 2.7V to 5.5V for optimal performance and to ensure the output voltage remains within the specified tolerance.
  • To ensure stability, make sure to follow the recommended PCB layout guidelines, use a sufficient output capacitor (at least 10uF), and keep the input and output capacitors close to the device. Additionally, avoid using long traces and minimize the distance between the input and output pins.
  • The MIC5303-1.8YMT-TR is rated for operation up to 125°C, but its performance may degrade at higher temperatures. It's recommended to derate the output current and voltage according to the temperature derating curve provided in the datasheet.
  • The output voltage tolerance of the MIC5303-1.8YMT-TR is specified as ±2% over the operating temperature range. To calculate the tolerance, multiply the nominal output voltage (1.8V) by the tolerance percentage (2%). This gives you a tolerance range of 1.764V to 1.836V.
  • Yes, the MIC5303-1.8YMT-TR can be used in an LDO configuration, but it's not optimized for low-dropout operation. The device has a typical dropout voltage of 300mV, which may not be suitable for all LDO applications. However, it can still be used in LDO configurations where the input voltage is close to the output voltage.

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MIC5303-1.8YMT-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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