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MIC5319YML-TR - Microchip

Description: MICROCHIP - MIC5319YML-TR - LDO Voltage Regulator, Adjustable, 2.5V to 5.5V input, 200 mV drop., 1.25V to 5.5V/0.5A out, MLF-6

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MIC5319YML-TR - Microchip - PCB symbol
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PCB Footprints
MIC5319YML-TR - Microchip PCB footprint - Small Outline No-lead - Small Outline No-lead - 6-Lead 2 mm x 2 mm DFN
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3D Models
MIC5319YML-TR - Microchip - 3D model - Small Outline No-lead - 6-Lead 2 mm x 2 mm DFN
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MIC5319YML-TR Details

  • Manufacturer Part Number:

    MIC5319YML-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    2 X 2 MM, LEAD FREE, MLF-6

  • Pin Count:

    6

  • Manufacturer Package Code:

    VDFN-6

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Adjustability:

    ADJUSTABLE

  • Dropout Voltage1-Max:

    0.4 V

  • Dropout Voltage1-Nom:

    0.2 V

  • JESD-30 Code:

    S-XDSO-N6

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Load Regulation-Max(%):

    0.5%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    6

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Voltage1-Max:

    5.5 V

  • Output Voltage1-Min:

    1.25 V

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC6,.08,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    ADJUSTABLE POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    0.6 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Width:

    2 mm

MIC5319YML-TR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the MIC5319YML-TR near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Additionally, keeping the thermal path short and direct can help to reduce thermal resistance.
  • To ensure stability and prevent oscillations in the output voltage, it's essential to follow the recommended component values and PCB layout guidelines. Additionally, ensure that the output capacitor is of high quality and has a low equivalent series resistance (ESR). A minimum output capacitance of 10uF is recommended, and the capacitor should be placed close to the MIC5319YML-TR.
  • The maximum input voltage that can be applied to the MIC5319YML-TR is 6V. Exceeding this voltage can cause damage to the device. It's essential to ensure that the input voltage is within the recommended operating range to ensure reliable operation and prevent damage.
  • The output voltage of the MIC5319YML-TR can be adjusted by using a resistive divider network between the output pin and the adjust pin. The output voltage can be calculated using the formula: Vout = 1.24V x (1 + R1/R2), where R1 and R2 are the resistors in the divider network.
  • The minimum input capacitance required for the MIC5319YML-TR is 1uF. However, it's recommended to use a higher value capacitor, such as 4.7uF or 10uF, to ensure stable operation and to filter out noise and ripple on the input voltage.

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MIC5319YML-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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