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MIC5335-SGYMT-TR - Microchip

Description: LDO Voltage Regulators Dual 300mA LDO Dual EN

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MIC5335-SGYMT-TR - Microchip PCB footprint - Small Outline No-lead - Small Outline No-lead - 6 - pin 1.6 mm x 1.6 mmjbh 1TDFN
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MIC5335-SGYMT-TR - Microchip  - 3D model - Small Outline No-lead - 6 - pin 1.6 mm x 1.6 mmjbh 1TDFN
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MIC5335-SGYMT-TR Details

  • Manufacturer Part Number:

    MIC5335-SGYMT-TR

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TDFN-6

  • Pin Count:

    6

  • Manufacturer Package Code:

    UDFN-6

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.2 V

  • Dropout Voltage1-Nom:

    0.075 V

  • Dropout Voltage2-Max:

    0.2 V

  • Input Voltage Absolute-Max:

    6 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    4.3 V

  • JESD-30 Code:

    S-PDSO-N6

  • JESD-609 Code:

    e4

  • Length:

    1.6 mm

  • Line Regulation-Max:

    0.02376%

  • Load Regulation-Max:

    0.066%

  • Number of Functions:

    1

  • Number of Outputs:

    2

  • Number of Terminals:

    6

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.3 A

  • Output Current2-Max:

    0.3 A

  • Output Voltage1-Max:

    3.399 V

  • Output Voltage1-Min:

    3.201 V

  • Output Voltage1-Nom:

    3.3 V

  • Output Voltage2-Max:

    1.854 V

  • Output Voltage2-Min:

    1.746 V

  • Output Voltage2-Nom:

    1.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC6,.06,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Regulator Type:

    FIXED POSITIVE MULTIPLE OUTPUT LDO REGULATOR

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    0.6 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Voltage Tolerance-Max:

    3%

  • Width:

    1.6 mm

MIC5335-SGYMT-TR Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it is recommended to have a solid ground plane underneath the device, and to use thermal vias to connect the exposed pad to the ground plane. Additionally, keeping the PCB traces as short and wide as possible can help to reduce thermal resistance.
  • To ensure stability and prevent oscillations, it is recommended to use a minimum output capacitance of 10uF, and to place the capacitor as close to the output pin as possible. Additionally, using a low-ESR capacitor and minimizing the PCB trace inductance can also help to prevent oscillations.
  • The maximum input voltage that can be applied to the MIC5335-SGYMT-TR is 6V. Exceeding this voltage can cause damage to the device.
  • The power dissipation of the MIC5335-SGYMT-TR can be calculated using the formula: Pd = (Vin - Vout) x Iout. Where Vin is the input voltage, Vout is the output voltage, and Iout is the output current.
  • The recommended input capacitor value is 1uF to 10uF, and it should be a ceramic or film capacitor with a voltage rating of at least 6.3V. The capacitor should be placed as close to the input pin as possible to reduce noise and ripple.

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MIC5335-SGYMT-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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