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MIC5357-MGYMME - Microchip

Description: Linear Voltage Regulator IC Positive Fixed 2 Output 500mA, 500mA 8-MSOP-EP

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MIC5357-MGYMME - Microchip - PCB symbol
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PCB Footprints
MIC5357-MGYMME - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 8-Pin ePAD MSOP (MME)
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3D Models
MIC5357-MGYMME - Microchip - 3D model - Small Outline Packages - 8-Pin ePAD MSOP (MME)
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MIC5357-MGYMME Details

  • Manufacturer Part Number:

    MIC5357-MGYMME

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    MSOP-8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    13

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.3 V

  • Dropout Voltage1-Nom:

    0.13 V

  • Dropout Voltage2-Max:

    0.3 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2.6 V

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Load Regulation-Max:

    0.07%

  • Number of Functions:

    1

  • Number of Outputs:

    2

  • Number of Terminals:

    8

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.5 A

  • Output Current2-Max:

    0.5 A

  • Output Voltage1-Max:

    2.884 V

  • Output Voltage1-Min:

    2.716 V

  • Output Voltage1-Nom:

    2.8 V

  • Output Voltage2-Max:

    1.854 V

  • Output Voltage2-Min:

    1.746 V

  • Output Voltage2-Nom:

    1.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Regulator Type:

    FIXED POSITIVE MULTIPLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    1.04 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    3 mm

MIC5357-MGYMME Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it is recommended to use a 4-layer PCB with a solid ground plane on the bottom layer, and to place thermal vias under the IC to dissipate heat. Additionally, keep the PCB traces as short and wide as possible to reduce thermal resistance.
  • To ensure stability and prevent oscillations, it is recommended to use a minimum output capacitance of 10uF, and to place a 1uF ceramic capacitor in parallel with the output capacitor to filter out high-frequency noise. Additionally, ensure that the input and output capacitors are placed close to the IC and connected with short, wide traces.
  • The maximum input voltage that can be applied to the MIC5357-MGYMME is 6V. Exceeding this voltage may cause damage to the IC or affect its performance.
  • The MIC5357-MGYMME is rated for operation up to 125°C. However, it is recommended to derate the output current and voltage at high temperatures to ensure reliable operation. Consult the datasheet for more information on thermal derating.
  • The output voltage ripple and noise can be calculated using the equations provided in the datasheet. The output voltage ripple is primarily dependent on the input voltage ripple, output capacitance, and switching frequency. The output noise is primarily dependent on the input noise, output capacitance, and switching frequency.

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MIC5357-MGYMME Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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