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MIC5514-1.8YMT-TR - Microchip

Description: LDO Voltage Regulators Single , 300mA LDO

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MIC5514-1.8YMT-TR - Microchip - PCB symbol
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PCB Footprints
MIC5514-1.8YMT-TR - Microchip PCB footprint - Small Outline No-lead - Small Outline No-lead - 6 pin dfn
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MIC5514-1.8YMT-TR - Microchip - 3D model - Small Outline No-lead - 6 pin dfn
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MIC5514-1.8YMT-TR Details

  • Manufacturer Part Number:

    MIC5514-1.8YMT-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TDFN-6

  • Pin Count:

    6

  • Manufacturer Package Code:

    UDFN-6

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    14

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.38 V

  • Dropout Voltage1-Nom:

    0.16 V

  • Input Voltage Absolute-Max:

    6 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2.5 V

  • JESD-30 Code:

    S-PDSO-N6

  • JESD-609 Code:

    e4

  • Length:

    1.6 mm

  • Line Regulation-Max:

    0.0162%

  • Load Regulation-Max:

    0.04%

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    6

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.3 A

  • Output Voltage1-Max:

    1.854 V

  • Output Voltage1-Min:

    1.746 V

  • Output Voltage1-Nom:

    1.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC6,.06,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    0.6 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Voltage Tolerance-Max:

    3%

  • Width:

    1.6 mm

MIC5514-1.8YMT-TR Frequently Asked Questions (FAQs)

  • A good PCB layout for MIC5514-1.8YMT-TR involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing trace lengths and loops. It's also recommended to use a separate analog ground plane and to keep digital signals away from the analog section.
  • To ensure stability, make sure to follow the recommended PCB layout, use the correct output capacitor value and type, and ensure that the input voltage is within the recommended range. Additionally, adding a small ceramic capacitor (e.g. 10nF) between the output and ground can help to improve stability.
  • Although the datasheet specifies a maximum input voltage of 6V, it's recommended to limit the input voltage to 5.5V to ensure reliable operation and to prevent damage to the device.
  • The MIC5514-1.8YMT-TR is rated for operation up to 125°C, but it's recommended to derate the output current and power dissipation at higher temperatures to ensure reliable operation. Consult the datasheet for more information on thermal derating.
  • The power dissipation of MIC5514-1.8YMT-TR can be calculated using the formula: Pd = (Vin - Vout) x Iout + (Vin x Iq), where Vin is the input voltage, Vout is the output voltage, Iout is the output current, and Iq is the quiescent current. Consult the datasheet for more information on power dissipation calculations.

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MIC5514-1.8YMT-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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