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MIC5801YWM-TR - Microchip

Description: MICROCHIP - MIC5801YWM-TR - PARALLEL LATCHED DRIVER, -40 TO 85DEG C

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MIC5801YWM-TR - Microchip - PCB symbol
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MIC5801YWM-TR - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 24-Lead SOICW
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MIC5801YWM-TR - Microchip - 3D model - Small Outline Packages - 24-Lead SOICW
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MIC5801YWM-TR Details

  • Manufacturer Part Number:

    MIC5801YWM-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    24

  • Manufacturer Package Code:

    SOIC-24

  • Country Of Origin:

    Philippines, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Additional Feature:

    SEATED HT-CALCULATED

  • Built-in Protections:

    TRANSIENT

  • Driver Number of Bits:

    8

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G24

  • JESD-609 Code:

    e3

  • Length:

    15.42 mm

  • Number of Functions:

    8

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current Flow Direction:

    SINK

  • Output Polarity:

    INVERTED

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP24,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.64 mm

  • Supply Current-Max:

    2 mA

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    7.52 mm

MIC5801YWM-TR Frequently Asked Questions (FAQs)

  • A good PCB layout for MIC5801YWM-TR involves keeping the input and output traces separate, using a solid ground plane, and placing the input and output capacitors close to the IC. Additionally, it's recommended to use a shielded inductor and to keep the switching node (SW) away from sensitive analog circuits.
  • To ensure the MIC5801YWM-TR operates within its safe operating area (SOA), monitor the input voltage, output current, and junction temperature. Ensure the input voltage is within the recommended range, the output current is within the maximum rating, and the junction temperature is below the maximum rating of 150°C.
  • A low-ESR ceramic capacitor with a value of 10uF to 22uF is recommended for the input capacitor. The capacitor should be placed close to the VIN pin and have a voltage rating of at least 2x the maximum input voltage.
  • To optimize the MIC5801YWM-TR for low standby power consumption, ensure the EN pin is properly biased, use a low-quiescent-current voltage regulator, and minimize the input voltage. Additionally, consider using a low-power mode or shutdown feature if available.
  • A low-ESR ceramic capacitor with a value of 10uF to 22uF is recommended for the output capacitor. The capacitor should be placed close to the VOUT pin and have a voltage rating of at least 2x the maximum output voltage.

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MIC5801YWM-TR Overview

Use the download button to access the MIC5801YWM-TR schematic symbol, PCB footprint, and 3D model.
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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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