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MIC7221YM5-TR - Microchip

Description: Comparator Rail-to-Rail Input SOT23-5

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PCB Footprints
MIC7221YM5-TR - Microchip PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - 5-pin SOT-23 (M5)
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MIC7221YM5-TR - Microchip  - 3D model - SOT23 (5-Pin) - 5-pin SOT-23 (M5)
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MIC7221YM5-TR Details

  • Manufacturer Part Number:

    MIC7221YM5-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOT-23, 5 PIN

  • Pin Count:

    5

  • Manufacturer Package Code:

    SOT-23-5

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Amplifier Type:

    COMPARATOR

  • Input Offset Voltage-Max:

    10000 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Type:

    OPEN-DRAIN

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Response Time-Nom:

    75 ns

  • Seated Height-Max:

    1.45 mm

  • Supply Current-Max:

    0.014 mA

  • Supply Voltage Limit-Max:

    12 V

  • Supply Voltage-Nom (Vsup):

    2.7 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    1.6 mm

MIC7221YM5-TR Frequently Asked Questions (FAQs)

  • A good PCB layout for MIC7221YM5-TR involves keeping the input and output traces separate, using a solid ground plane, and placing decoupling capacitors close to the device. Additionally, it's recommended to use a shielded inductor and keep the switching node (SW) away from sensitive analog nodes.
  • To ensure the MIC7221YM5-TR operates within its SOA, calculate the maximum allowable current and voltage based on the application's requirements. Monitor the device's junction temperature (TJ) and ensure it stays below the maximum rating of 150°C. Use thermal design and layout techniques, such as heat sinks or thermal vias, to dissipate heat effectively.
  • When selecting an inductor for MIC7221YM5-TR, consider the inductor's saturation current, DC resistance, and core material. Choose an inductor with a high saturation current rating to handle the peak current, and a low DC resistance to minimize power loss. Ferrite or iron powder cores are suitable for most applications.
  • To optimize the compensation network, start by selecting the desired crossover frequency and phase margin. Then, use the datasheet's recommended compensation components as a starting point. Use simulation tools or empirical methods to fine-tune the compensation network, ensuring stability and the desired transient response.
  • MIC7221YM5-TR is a high-current, high-frequency synchronous buck converter with a wide input voltage range. Compared to other devices, it offers higher efficiency, faster switching frequency, and a smaller package. It's ideal for high-power density applications, such as servers, data storage, and telecommunications equipment.

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MIC7221YM5-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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