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MIC833YM5-TR - Microchip

Description: Analog Comparators 1uA Undervoltage Comparator with 1.5% 1.24V Reference, Adjustable Hysteresis, Op

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Symbol
MIC833YM5-TR - Microchip - PCB symbol
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PCB Footprints
MIC833YM5-TR - Microchip PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - 5-pin SOT-23 (M5)
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3D Models
MIC833YM5-TR - Microchip - 3D model - SOT23 (5-Pin) - 5-pin SOT-23 (M5)
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MIC833YM5-TR Details

  • Manufacturer Part Number:

    MIC833YM5-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    ROHS COMPLIANT, SOT-23, 5 PIN

  • Pin Count:

    5

  • Manufacturer Package Code:

    SOT-23-5

  • Country Of Origin:

    Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    6

  • Amplifier Type:

    COMPARATOR

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Type:

    OPEN-DRAIN

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    SOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Response Time-Nom:

    5000 ns

  • Seated Height-Max:

    1.45 mm

  • Supply Current-Max:

    0.002 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    1.6 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Width:

    1.6 mm

MIC833YM5-TR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
  • To ensure reliable operation at high temperatures, it's essential to follow proper thermal design and layout guidelines, and to consider the device's thermal derating. Additionally, ensure that the device is operated within its specified temperature range.
  • For EMI and EMC compliance, it's crucial to follow proper PCB layout and design guidelines, such as using a solid ground plane, minimizing trace lengths, and using shielding and filtering components as needed. Additionally, ensure that the device is operated within its specified frequency range.
  • For proper power sequencing and startup, ensure that the power supplies are turned on in the correct order, and that the device is powered up slowly to prevent damage. Refer to the datasheet for specific power-up sequencing requirements.
  • For output capacitance and stability, ensure that the output capacitor is selected based on the device's output capacitance requirements, and that the capacitor is placed close to the device. Additionally, ensure that the device is operated within its specified output current range.

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MIC833YM5-TR Overview

Use the download button to access the MIC833YM5-TR schematic symbol, PCB footprint, and 3D model.
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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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