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MIC841NYC5-TR - Microchip

Description: Analog Comparators 1.5mA Undervoltage Comparator w/ 1.25% 1.24V Reference, Adj. Hysteresis, Active-

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MIC841NYC5-TR - Microchip - PCB symbol
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PCB Footprints
MIC841NYC5-TR - Microchip PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - SC70 1MM (C5)
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3D Models
MIC841NYC5-TR - Microchip - 3D model - SOT23 (5-Pin) - SC70 1MM (C5)
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MIC841NYC5-TR Details

  • Manufacturer Part Number:

    MIC841NYC5-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SC-70, 5 PIN

  • Pin Count:

    5

  • Manufacturer Package Code:

    SC70-5

  • Country Of Origin:

    Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    11 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    6

  • Amplifier Type:

    COMPARATOR

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2.02 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Type:

    OPEN-DRAIN

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP5/6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Response Time-Nom:

    12000 ns

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    0.003 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    1.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    1.25 mm

MIC841NYC5-TR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the MIC841NYC5-TR near a thermal pad or a heat sink, and ensuring good airflow around the device. The PCB should also have sufficient copper area to dissipate heat.
  • To ensure reliable operation at high temperatures, ensure that the device is operated within its specified temperature range, and that the PCB is designed to minimize thermal resistance. Additionally, consider using thermal interface materials to improve heat transfer.
  • Exceeding the maximum junction temperature can lead to reduced device lifespan, increased thermal resistance, and potentially even device failure. It is essential to ensure that the device operates within its specified temperature range to maintain reliability.
  • To handle ESD protection for the MIC841NYC5-TR, ensure that the device is handled and stored in an ESD-safe environment. Use ESD-protective packaging and handling materials, and consider implementing ESD protection circuits in the design.
  • When assembling and reworking the MIC841NYC5-TR on a PCB, ensure that the device is handled carefully to avoid damage. Use a reflow oven with a controlled temperature profile, and follow the manufacturer's recommended rework procedures.

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MIC841NYC5-TR Overview

Use the download button to access the MIC841NYC5-TR schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MIC84, or try a keyword search, such as Comparators

About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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