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MIC841NYMT-TR - Microchip

Description: Analog Comparators 1.5 UV Comparator with 1.25% 1.24V Ref

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Symbol
MIC841NYMT-TR - Microchip - PCB symbol
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PCB Footprints
MIC841NYMT-TR - Microchip PCB footprint - Small Outline No-lead - Small Outline No-lead - TDFN(MT)
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3D Models
MIC841NYMT-TR - Microchip - 3D model - Small Outline No-lead - TDFN(MT)
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MIC841NYMT-TR Details

  • Manufacturer Part Number:

    MIC841NYMT-TR

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TDFN-6

  • Pin Count:

    6

  • Manufacturer Package Code:

    UDFN-6

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    11 Weeks

  • Date Of Intro:

    2017-04-26

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    14

  • Amplifier Type:

    COMPARATOR

  • JESD-30 Code:

    S-PDSO-N6

  • JESD-609 Code:

    e4

  • Length:

    1.6 mm

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Type:

    OPEN-DRAIN

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC6,.06,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Response Time-Nom:

    12000 ns

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    0.6 mm

  • Supply Current-Max:

    0.003 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    1.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Width:

    1.6 mm

MIC841NYMT-TR Frequently Asked Questions (FAQs)

  • Microchip recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the thermal pad to connect to an internal copper plane or a heat sink.
  • To ensure reliable operation at high temperatures, it's essential to follow proper thermal design and layout guidelines. This includes providing adequate heat sinking, using a sufficient number of vias, and keeping the thermal pad connected to a large copper area. Additionally, consider using thermal interface materials (TIMs) to improve heat transfer between the device and the heat sink.
  • The MIC841NYMT-TR is a 1A low-dropout linear regulator. It's essential to ensure that the output current does not exceed 1A, and the input voltage does not exceed 15V. Exceeding these limits can lead to device damage or reduced performance.
  • The output capacitor should be chosen based on the desired output voltage ripple and stability. A minimum capacitance of 1uF is recommended, with an ESR (Equivalent Series Resistance) of less than 1 ohm. X5R or X7R ceramic capacitors are suitable options.
  • A 1uF to 10uF input capacitor is recommended to filter out input noise and ensure stable operation. The input capacitor should be placed as close to the device as possible, and its ESR should be less than 1 ohm.

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MIC841NYMT-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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