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MIC842HYMT-T5 - Microchip

Description: Microchip MIC842HYMT-T5 Comparator, Push-Pull O/P, 1.5 → 5.5 V 4-Pin TDFN

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Symbol
MIC842HYMT-T5 - Microchip - PCB symbol
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PCB Footprints
MIC842HYMT-T5 - Microchip PCB footprint - Other - Other - 4-Pin TDFN (MT)
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3D Models
MIC842HYMT-T5 - Microchip - 3D model - Other - 4-Pin TDFN (MT)
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MIC842HYMT-T5 Details

  • Manufacturer Part Number:

    MIC842HYMT-T5

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TDFN-4

  • Pin Count:

    4

  • Manufacturer Package Code:

    UDFN-4

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    10 Weeks

  • Date Of Intro:

    2017-04-26

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    13

  • Amplifier Type:

    COMPARATOR

  • JESD-30 Code:

    R-PDSO-N4

  • JESD-609 Code:

    e4

  • Length:

    1.2 mm

  • Number of Functions:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Type:

    PUSH-PULL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC6,.06,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Response Time-Nom:

    12000 ns

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    0.6 mm

  • Supply Current-Max:

    0.003 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    1.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Width:

    1.6 mm

MIC842HYMT-T5 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the thermal pad to the ground plane. This helps to dissipate heat efficiently.
  • To ensure reliable operation at high temperatures, it's essential to follow proper thermal design and layout guidelines, and to ensure that the device is operated within its specified temperature range. Additionally, consider using thermal interface materials and heat sinks to improve heat dissipation.
  • Exceeding the maximum junction temperature can lead to reduced device lifespan, decreased performance, and potentially even device failure. It's crucial to ensure that the device operates within its specified temperature range to maintain reliability and performance.
  • To handle ESD protection, it's recommended to follow proper ESD handling procedures during device handling and assembly. Additionally, consider using ESD protection devices, such as TVS diodes, to protect the MIC842HYMT-T5 from electrostatic discharge.
  • The recommended soldering conditions for the MIC842HYMT-T5 are a peak temperature of 260°C, with a soldering time of 10-30 seconds. It's essential to follow these conditions to prevent damage to the device.

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MIC842HYMT-T5 Overview

Use the download button to access the MIC842HYMT-T5 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MIC84, or try a keyword search, such as Comparators

About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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