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MIC842LYC5-TR - Microchip

Description: MICROCHIP - MIC842LYC5-TR - COMPARATOR, 1.24VREF, PUSH PULL, 5SC70

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PCB Footprints
MIC842LYC5-TR - Microchip PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - 5-Pin SC-70 (C5)
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3D Models
MIC842LYC5-TR - Microchip  - 3D model - SOT23 (5-Pin) - 5-Pin SC-70 (C5)
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MIC842LYC5-TR Details

  • Manufacturer Part Number:

    MIC842LYC5-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SC-70, 5 PIN

  • Pin Count:

    5

  • Manufacturer Package Code:

    SC70-5

  • Country Of Origin:

    Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Amplifier Type:

    COMPARATOR

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2.02 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Type:

    PUSH-PULL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP5/6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Response Time-Nom:

    12000 ns

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    0.003 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    1.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    1.25 mm

MIC842LYC5-TR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the MIC842LYC5-TR near a thermal pad or a heat sink, and ensuring good airflow around the device. The PCB should also have sufficient copper area to dissipate heat.
  • To ensure reliable operation over the full temperature range, it's essential to follow proper PCB design and layout guidelines, use a suitable thermal interface material, and ensure that the device is properly soldered and mounted.
  • For EMI and EMC compliance, it's crucial to follow proper PCB design and layout guidelines, use shielding and filtering where necessary, and ensure that the device is properly decoupled and bypassed.
  • To handle overvoltage and undervoltage conditions, it's recommended to use voltage regulators with built-in overvoltage protection (OVP) and undervoltage lockout (UVLO) features, and to add external protection circuits if necessary.
  • Recommended test and measurement techniques for the MIC842LYC5-TR include using a digital multimeter to measure voltage and current, and using an oscilloscope to measure waveforms and transient responses.

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MIC842LYC5-TR Overview

Use the download button to access the MIC842LYC5-TR schematic symbol, PCB footprint, and 3D model.
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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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