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MIC94083YFT-TR - Microchip

Description: Power Switch ICs - Power Distribution High-side Load Switch, 1.5A, 67mOhm

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MIC94083YFT-TR - Microchip - PCB symbol
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MIC94083YFT-TR - Microchip PCB footprint - Other - Other - MIC94083YFT-TR-2
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MIC94083YFT-TR - Microchip - 3D model - Other - MIC94083YFT-TR-2
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MIC94083YFT-TR Details

  • Manufacturer Part Number:

    MIC94083YFT-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    VSON, SOLCC4,.03,16

  • Pin Count:

    4

  • Manufacturer Package Code:

    UDFN-4

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    38 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    S-PDSO-N4

  • Length:

    0.85 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSON

  • Package Equivalence Code:

    SOLCC4,.03,16

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    0.6 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.7 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel (Ni)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    DUAL

  • Width:

    0.85 mm

MIC94083YFT-TR Frequently Asked Questions (FAQs)

  • A good thermal design should include a solid ground plane, thermal vias, and a heat sink if necessary. The datasheet provides some guidelines, but a more detailed application note or a thermal simulation tool can help optimize the design.
  • In addition to following the recommended operating conditions, ensure that the device is properly decoupled, and the power supply is stable and clean. Also, consider the thermal derating of the device and the PCB.
  • The quiescent current of the MIC94083YFT-TR is relatively low, but it can still impact the overall power consumption of your system. Consider the device's idle mode and shutdown features to minimize power consumption when not in use.
  • Use a systematic approach to troubleshoot, starting with the basics: check the power supply, decoupling, and PCB layout. Use oscilloscopes and logic analyzers to monitor signals and identify anomalies. Consult the datasheet and application notes for guidance.
  • Yes, the MIC94083YFT-TR is a high-frequency device, and proper EMI/EMC design practices are essential. Ensure proper shielding, grounding, and decoupling, and follow the recommended layout guidelines to minimize radiation and susceptibility.

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MIC94083YFT-TR Overview

Use the download button to access the MIC94083YFT-TR schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MIC94, or try a keyword search, such as Peripheral Drivers

About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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