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MIC94085YFT-TR - Microchip

Description: Power Switch Hi Side 1-OUT 2A 0.2Ohm 4-Pin FTDFN T/R

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MIC94085YFT-TR - Microchip PCB footprint - Other - Other - MIC94085YFT-TR-2
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MIC94085YFT-TR - Microchip  - 3D model - Other - MIC94085YFT-TR-2
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MIC94085YFT-TR Details

  • Manufacturer Part Number:

    MIC94085YFT-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FTDFN-4

  • Pin Count:

    4

  • Manufacturer Package Code:

    UDFN-4

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    S-PDSO-N4

  • Length:

    0.85 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSON

  • Package Equivalence Code:

    SOLCC4,.03,16

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    0.6 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.7 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel (Ni)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    DUAL

  • Width:

    0.85 mm

MIC94085YFT-TR Frequently Asked Questions (FAQs)

  • A good thermal design should include a solid ground plane, thermal vias, and a heat sink if necessary. The datasheet provides some guidelines, but a more detailed application note or a thermal simulation tool can help optimize the design.
  • In addition to following the recommended operating conditions, ensure that the device is properly decoupled, and the power supply is stable and clean. Also, consider the thermal derating and adjust the design accordingly.
  • The quiescent current affects the overall system power consumption. Consider the device's idle mode and shutdown features to minimize power consumption. Also, calculate the total power budget and ensure it meets the system's requirements.
  • Use a systematic approach to troubleshoot, starting with the basics: check the power supply, decoupling, and PCB layout. Use oscilloscopes and logic analyzers to debug the issue. Consult the datasheet, application notes, and Microchip's support resources for guidance.
  • Follow proper PCB layout and routing guidelines to minimize EMI. Ensure proper shielding, grounding, and decoupling. Consider using EMI filters or common-mode chokes if necessary. Consult the datasheet and relevant application notes for more information.

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MIC94085YFT-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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