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MIC94090YC6-TR - Microchip

Description: Power Switch ICs - Power Distribution High Side Load Switch 1.2A, 130m

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PCB Footprints
MIC94090YC6-TR - Microchip PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - 6-PIN_SC70_(C6)
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3D Models
MIC94090YC6-TR - Microchip  - 3D model - SOT23 (6-Pin) - 6-PIN_SC70_(C6)
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MIC94090YC6-TR Details

  • Manufacturer Part Number:

    MIC94090YC6-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    6

  • Manufacturer Package Code:

    SC70-6

  • Country Of Origin:

    Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    Load switch

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e4

  • Length:

    2.025 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.7 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    1.25 mm

MIC94090YC6-TR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
  • To ensure reliable operation across the entire operating temperature range, it's essential to follow proper PCB design and layout guidelines, use a suitable thermal management strategy, and ensure that the device is operated within its specified voltage and current ratings.
  • For EMI and EMC compliance, it's crucial to follow proper PCB design and layout guidelines, use shielding and filtering where necessary, and ensure that the device is operated within its specified voltage and current ratings. Additionally, consider using a common-mode choke and a ferrite bead in the power supply lines to reduce EMI emissions.
  • To troubleshoot issues with the MIC94090YC6-TR, start by checking the power supply voltage and current, then verify that the input and output voltages are within the specified ranges. Use an oscilloscope to check for any unusual voltage or current waveforms, and consult the datasheet and application notes for guidance on troubleshooting specific issues.
  • Operating the MIC94090YC6-TR at high ambient temperatures can reduce its reliability and lifespan. It's essential to ensure that the device is operated within its specified temperature range and that proper thermal management strategies are implemented to prevent overheating.

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MIC94090YC6-TR Overview

Use the download button to access the MIC94090YC6-TR schematic symbol, PCB footprint, and 3D model.
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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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