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MIC94094YC6-TR - Microchip

Description: Power Switch ICs - Power Distribution High Side Load Switch 1.2A, 130m

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MIC94094YC6-TR - Microchip - PCB symbol
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PCB Footprints
MIC94094YC6-TR - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - sc-70
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MIC94094YC6-TR - Microchip - 3D model - Small Outline Packages - sc-70
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MIC94094YC6-TR Details

  • Manufacturer Part Number:

    MIC94094YC6-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSSOP, TSSOP6,.08

  • Pin Count:

    6

  • Manufacturer Package Code:

    SC70-6

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    Load switch

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e4

  • Length:

    2.025 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.7 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    1.25 mm

MIC94094YC6-TR Frequently Asked Questions (FAQs)

  • A good thermal design should include a solid ground plane, thermal vias, and a heat sink if necessary. The datasheet provides some guidelines, but a more detailed application note or a thermal simulation tool can help optimize the design.
  • To ensure reliable operation, follow the recommended operating conditions, use a suitable thermal design, and consider the device's thermal derating. Also, ensure that the device is properly soldered and that the PCB is free of defects.
  • Exceeding the maximum junction temperature can lead to reduced lifespan, decreased performance, and even device failure. It's essential to design for thermal margins and monitor the device's temperature to prevent overheating.
  • Start by reviewing the datasheet and application notes. Check the device's pinout, voltage supply, and signal integrity. Use oscilloscopes or logic analyzers to debug the issue. If necessary, contact Microchip's technical support or a local distributor for assistance.
  • Yes, follow proper PCB design practices, such as using a solid ground plane, minimizing trace lengths, and using shielding if necessary. Ensure that the device is properly decoupled, and consider using EMI filters or common-mode chokes if required.

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MIC94094YC6-TR Overview

Use the download button to access the MIC94094YC6-TR schematic symbol, PCB footprint, and 3D model.
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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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