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MIC94095YC6-TR - Microchip

Description: Power Switch ICs - Power Distribution High Side Load Switch 1.2A, 130m

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MIC94095YC6-TR - Microchip - PCB symbol
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PCB Footprints
MIC94095YC6-TR - Microchip PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - 6 pin sc-70 (C6)
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3D Models
MIC94095YC6-TR - Microchip - 3D model - SOT23 (6-Pin) - 6 pin sc-70 (C6)
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MIC94095YC6-TR Details

  • Manufacturer Part Number:

    MIC94095YC6-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSSOP, TSSOP6,.08

  • Pin Count:

    6

  • Manufacturer Package Code:

    SC70-6

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    Load switch

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e4

  • Length:

    2.025 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.7 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    1.25 mm

MIC94095YC6-TR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
  • To ensure reliable operation at high temperatures, make sure to follow the recommended operating conditions, use a suitable thermal interface material, and ensure good airflow around the device. Also, consider using a heat sink if the device is expected to operate at high temperatures for extended periods.
  • Exceeding the maximum junction temperature can lead to reduced lifespan, decreased performance, and even permanent damage to the device. It's essential to ensure that the device operates within the recommended temperature range to maintain reliability and performance.
  • To troubleshoot issues with the MIC94095YC6-TR, start by checking the power supply voltage, input/output connections, and PCB layout. Use oscilloscopes and logic analyzers to debug the signal waveforms and timing. Consult the datasheet and application notes for guidance on troubleshooting specific issues.
  • The MIC94095YC6-TR has built-in ESD protection and latch-up prevention measures, including diodes and resistors that protect the device from electrostatic discharge and latch-up. However, it's still essential to follow proper handling and assembly procedures to prevent damage during manufacturing and operation.

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MIC94095YC6-TR Overview

Use the download button to access the MIC94095YC6-TR schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MIC94, or try a keyword search, such as Peripheral Drivers

About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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