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MIC94165YCS-TR - Microchip

Description: MICROCHIP - MIC94165YCS-TR - Power Load Distribution Switch IC, Active High, 1 Output, 5.5 V in, 3 A, 0.0145 ohm, WLCSP-6

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MIC94165YCS-TR - Microchip - PCB symbol
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PCB Footprints
MIC94165YCS-TR - Microchip PCB footprint - BGA - BGA - MIC94162YCS
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3D Models
MIC94165YCS-TR - Microchip - 3D model - BGA - MIC94162YCS
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MIC94165YCS-TR Details

  • Manufacturer Part Number:

    MIC94165YCS-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA, BGA6,2X3,20

  • Pin Count:

    6

  • Manufacturer Package Code:

    WLCSP-6

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    33 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    14

  • Additional Feature:

    OVER VOLTAGE PROTECTION

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    Load switch

  • JESD-30 Code:

    R-XBGA-B6

  • JESD-609 Code:

    e1

  • Length:

    1.5 mm

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA6,2X3,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY

  • Seated Height-Max:

    0.75 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.7 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Threshold Voltage-Nom:

    +4.75V

  • Width:

    1 mm

MIC94165YCS-TR Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. The MIC94165YCS-TR has an exposed thermal pad that should be connected to the ground plane.
  • Ensure that the device is operated within the recommended operating temperature range (-40°C to 125°C). Use a heat sink or thermal interface material to improve heat dissipation. Also, ensure that the PCB is designed to minimize thermal resistance.
  • A 10uF to 22uF X5R or X7R ceramic capacitor is recommended for the input capacitor. The capacitor should be placed as close to the VIN pin as possible to minimize noise and ensure stable operation.
  • Use a shielded inductor, keep the switching node (SW pin) away from sensitive nodes, and use a common-mode choke to reduce EMI. Also, ensure that the PCB is designed to minimize radiation and conduction of EMI.
  • A 10uF to 22uF X5R or X7R ceramic capacitor is recommended for the output capacitor. The capacitor should be placed as close to the VOUT pin as possible to minimize noise and ensure stable operation.

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MIC94165YCS-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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