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MICROSMD005F-2 - LITTELFUSE

Description: Littelfuse 0.05A Surface Mount Resettable Fuse, 30V dc

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Symbol
MICROSMD005F-2 - LITTELFUSE - PCB symbol
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PCB Footprints
MICROSMD005F-2 - LITTELFUSE PCB footprint - Other - Other - MICROSMD005F-2
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3D Models
MICROSMD005F-2 - LITTELFUSE - 3D model - Other - MICROSMD005F-2
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MICROSMD005F-2 Details

  • Manufacturer Part Number:

    MICROSMD005F-2

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.40.80.70

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    8.25

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    0.85 mm

  • Package Length:

    3.43 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    2.8 mm

  • Packing Method:

    TR, EMBOSSED, 7 INCH

  • Reference Standard:

    CSA; TUV; UL

  • Resistance:

    3.6 Ω

  • Resistor Type:

    PTC RESETTABLE FUSE

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Thermistor Application:

    OVERCURRENT PROTECTION

  • Working Voltage:

    30 V

MICROSMD005F-2 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MICROSMD005F-2 is a rectangular pad with a size of 1.5mm x 0.8mm, with a solder mask clearance of 0.1mm.
  • Yes, MICROSMD005F-2 is rated for operation up to 150°C, making it suitable for high-temperature applications. However, the device's performance and reliability may degrade at extreme temperatures.
  • Handle the device by the body, avoiding touching the leads or the glass passivation. Use a vacuum pickup or tweezers to handle the device during assembly and rework. Avoid bending or flexing the leads, as this can cause damage.
  • The recommended soldering profile for MICROSMD005F-2 is a peak temperature of 260°C, with a dwell time of 10-30 seconds. The device is compatible with lead-free soldering processes.
  • Yes, MICROSMD005F-2 is designed to withstand high-vibration environments. However, the device's performance and reliability may be affected by extreme vibration. It is recommended to follow the manufacturer's guidelines for vibration testing and qualification.

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MICROSMD005F-2 Overview

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