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MIMX8ML2CVNKZAB - NXP

Description: ARM® Cortex®-A53 Microprocessor IC i.MX8ML 2 Core, 64-Bit 1.6GHz 548-LFBGA (15x15), -40°C ~ 105°C

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Symbol
MIMX8ML2CVNKZAB - NXP - PCB symbol
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PCB Footprints
MIMX8ML2CVNKZAB - NXP PCB footprint - BGA - BGA - SOT2047-1_2025
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3D Models
MIMX8ML2CVNKZAB - NXP - 3D model - BGA - SOT2047-1_2025
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MIMX8ML2CVNKZAB Details

  • Manufacturer Part Number:

    MIMX8ML2CVNKZAB

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCBGA-548

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    10

  • JESD-30 Code:

    S-PBGA-B548

  • Length:

    15 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    548

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA548,29X29,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.481 mm

  • Supply Voltage-Max:

    1 V

  • Supply Voltage-Min:

    0.9 V

  • Supply Voltage-Nom:

    0.95 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Bismuth (Sn/Bi)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    15 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

MIMX8ML2CVNKZAB Frequently Asked Questions (FAQs)

  • The recommended power-on sequence is to power up the VDD_HIGH first, followed by VDD_LOW, and then the core voltage (VDD_CORE). This ensures that the internal voltage regulators are properly enabled and the device boots up correctly.
  • The DDR memory interface on the MIMX8ML2CVNKZAB can be configured using the DDR Controller (DDRC) registers. The DDRC is responsible for controlling the DDR memory interface and can be configured using the Clock Control Module (CCM) and the DDR PHY registers. Refer to the NXP documentation and the Linux kernel source code for more information.
  • The maximum operating temperature range for the MIMX8ML2CVNKZAB is -40°C to 105°C. However, it's recommended to operate the device within the industrial temperature range of -40°C to 85°C for optimal performance and reliability.
  • Secure boot on the MIMX8ML2CVNKZAB can be implemented using the Boot ROM and the Fuse Box. The Boot ROM provides a secure boot mechanism that verifies the authenticity of the boot loader and the operating system. The Fuse Box provides a way to store secure boot keys and certificates. Refer to the NXP documentation and the Linux kernel source code for more information.
  • The maximum clock frequency supported by the MIMX8ML2CVNKZAB is 1.6 GHz. However, the actual clock frequency may vary depending on the specific use case and the power consumption requirements.

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MIMX8ML2CVNKZAB Overview

Use the download button to access the MIMX8ML2CVNKZAB schematic symbol, PCB footprint, and 3D model.
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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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