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MIMX8QM5CVUFFAB - NXP

Description: i.MX 8 Family – Arm® Cortex®-A53, Cortex-A72, Virtualization, Vision, 3D Graphics, 4K Video

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MIMX8QM5CVUFFAB Details

  • Manufacturer Part Number:

    MIMX8QM5CVUFFAB

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCBGA-1313

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    8

  • JESD-30 Code:

    S-PBGA-B1313

  • Length:

    29 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    1313

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1313,53X53,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    2.52 mm

  • Supply Voltage-Max:

    1.1 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin/Bismuth (Sn/Bi)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    29 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

MIMX8QM5CVUFFAB Frequently Asked Questions (FAQs)

  • The recommended power-on sequence is to power up the VDD_HIGH first, followed by VDD_SOC, and then the other power rails. This ensures that the internal voltage regulators are powered up in the correct order.
  • The DDR memory interface on the MIMX8QM5CVUFFAB is configured using the DDR Controller (DDRC) module. The DDRC module is programmed using the DDR Controller Register (DDRC_REG) and the DDR PHY Register (DDRC_PHY_REG). The configuration involves setting the memory type, clock frequency, and other parameters.
  • The maximum operating temperature range for the MIMX8QM5CVUFFAB is -40°C to 105°C. However, the device can be operated at a reduced frequency and voltage at higher temperatures up to 125°C.
  • Secure boot on the MIMX8QM5CVUFFAB is implemented using the Boot ROM and the Fuse Box. The Boot ROM verifies the authenticity of the boot loader and the operating system using digital signatures. The Fuse Box stores the secure boot keys and configuration.
  • The maximum clock frequency for the Cortex-A53 core is 1.6 GHz, and for the Cortex-M4 core is 266 MHz.

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MIMX8QM5CVUFFAB Overview

Use the download button to access the MIMX8QM5CVUFFAB 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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