MIMX8QM6AVUFFAB - NXP

MIMX8QM6AVUFFAB Details

• Manufacturer Part Number:

  MIMX8QM6AVUFFAB

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Not Recommended

• Package Description:

  FCBGA-1313

• ECCN Code:

  5A992.C

• HTS Code:

  8542.31.00.01

• Factory Lead Time:

  26 Weeks

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  8

• Boundary Scan:

  YES

• Bus Compatibility:

  CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB

• Clock Frequency-Max:

  24 MHz

• JESD-30 Code:

  S-PBGA-B1313

• JESD-609 Code:

  e6

• Length:

  29 mm

• Moisture Sensitivity Level:

  3

• Number of I/O Lines:

  1

• Number of Terminals:

  1313

• Operating Temperature-Max:

  125 °C

• Operating Temperature-Min:

  -40 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  FBGA

• Package Equivalence Code:

  BGA1313,53X53,30

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, FINE PITCH

• Peak Reflow Temperature (Cel):

  260

• RAM (words):

  524288

• Screening Level:

  AEC-Q100

• Seated Height-Max:

  2.52 mm

• Supply Current-Max:

  5000 mA

• Supply Voltage-Max:

  1.15 V

• Supply Voltage-Min:

  1.05 V

• Supply Voltage-Nom:

  1.1 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  AUTOMOTIVE

• Terminal Finish:

  Tin/Bismuth (Sn/Bi)

• Terminal Form:

  BALL

• Terminal Pitch:

  0.75 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  40

• Width:

  29 mm

• uPs/uCs/Peripheral ICs Type:

  SoC