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MIMX8UD5CVP08SC - NXP

Description: RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications

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PCB Footprints
MIMX8UD5CVP08SC - NXP PCB footprint - BGA - BGA - SOT2052-1
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3D Models
MIMX8UD5CVP08SC - NXP  - 3D model - BGA - SOT2052-1
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MIMX8UD5CVP08SC Details

  • Manufacturer Part Number:

    MIMX8UD5CVP08SC

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MABGA-485

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    13

  • JESD-30 Code:

    S-PBGA-B485

  • Length:

    15 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    485

  • Operating Temperature-Max:

    95 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA485,29X29,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.52 mm

  • Supply Voltage-Max:

    1.15 V

  • Supply Voltage-Min:

    1 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    15 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

MIMX8UD5CVP08SC Frequently Asked Questions (FAQs)

  • The recommended power-on sequence is to power up the VDD_HIGH first, followed by VDD_LOW, and then the core voltage (VDD_CORE). This ensures that the internal voltage regulators are properly enabled and the device boots up correctly.
  • The DDR memory interface on the MIMX8UD5CVP08SC can be configured using the DDR Controller (DDRC) registers. The DDRC is responsible for controlling the DDR memory interface and can be configured to support different DDR memory types and speeds. Refer to the NXP documentation and the Linux kernel source code for examples on how to configure the DDRC.
  • The maximum operating temperature range for the MIMX8UD5CVP08SC is -40°C to 105°C. However, it's recommended to operate the device within the industrial temperature range of -40°C to 85°C for optimal performance and reliability.
  • Secure boot on the MIMX8UD5CVP08SC can be implemented using the High-Assurance Boot (HAB) mechanism. HAB provides a secure boot process that ensures the authenticity and integrity of the boot loader and operating system. Refer to the NXP documentation and the HAB user guide for more information on how to implement secure boot.
  • The maximum clock frequency supported by the MIMX8UD5CVP08SC is 1.6 GHz. However, the actual clock frequency may vary depending on the specific use case and power consumption requirements.

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MIMX8UD5CVP08SC Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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