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MIMX8UX5AVLFZAC - NXP

Description: Microprocessors - MPU i.MX 8DualX

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PCB Footprints
MIMX8UX5AVLFZAC - NXP PCB footprint - BGA - BGA - 21 x 21 mm FCPBGA
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3D Models
MIMX8UX5AVLFZAC - NXP  - 3D model - BGA - 21 x 21 mm FCPBGA
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MIMX8UX5AVLFZAC Details

  • Manufacturer Part Number:

    MIMX8UX5AVLFZAC

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCPBGA-609

  • Country Of Origin:

    Malaysia, South Korea

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    26 Weeks

  • Date Of Intro:

    2020-04-09

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    12

  • Boundary Scan:

    YES

  • Bus Compatibility:

    CAN(3), SAI(4), SPI(4), UART(6)

  • Clock Frequency-Max:

    24 MHz

  • JESD-30 Code:

    S-PBGA-B609

  • JESD-609 Code:

    e2

  • Length:

    21 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    99

  • Number of Terminals:

    609

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA609,35X35,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • RAM (words):

    512000

  • Seated Height-Max:

    2.52 mm

  • Supply Current-Max:

    5000 mA

  • Supply Voltage-Max:

    1.15 V

  • Supply Voltage-Min:

    1.05 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin/Silver (Sn/Ag)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    21 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

MIMX8UX5AVLFZAC Frequently Asked Questions (FAQs)

  • The recommended power-on sequence is to power up the VDD_HIGH first, followed by VDD_LOW, and then the core voltage (VDD_CORE). This ensures that the internal voltage regulators are properly enabled.
  • The DDR memory interface can be configured using the DDRPHY register settings. The recommended settings can be found in the NXP application note AN12115. Additionally, the DDR memory interface can be configured using the NXP-provided DDR tuning tool.
  • The maximum operating temperature range for the MIMX8UX5AVLFZAC is -40°C to 105°C. However, the device can be operated at a reduced frequency and voltage at higher temperatures up to 125°C.
  • Secure boot on the MIMX8UX5AVLFZAC can be implemented using the High-Assurance Boot (HAB) mechanism. This involves generating a secure boot image using the NXP-provided tools and programming it into the device's boot fuses.
  • The maximum clock frequency for the Cortex-A35 core on the MIMX8UX5AVLFZAC is 1.6 GHz. However, the actual clock frequency may vary depending on the device's operating conditions and power management settings.

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MIMX8UX5AVLFZAC Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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