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MIMX9301CVVXDAB - NXP

Description: Processors - Application Specialized i.MX93 BGA11

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MIMX9301CVVXDAB - NXP - PCB symbol
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PCB Footprints
MIMX9301CVVXDAB - NXP PCB footprint - BGA - BGA - FC-PBGA-306 14*14*1.344 PKG. 0.65 PITCH
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MIMX9301CVVXDAB - NXP - 3D model - BGA - FC-PBGA-306 14*14*1.344 PKG. 0.65 PITCH
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MIMX9301CVVXDAB Details

  • Manufacturer Part Number:

    MIMX9301CVVXDAB

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCBGA-306

  • Country Of Origin:

    South Korea, Taiwan

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    12

  • JESD-30 Code:

    S-PBGA-B306

  • Length:

    11 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    306

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA306,21X21,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.22 mm

  • Supply Voltage-Max:

    0.9 V

  • Supply Voltage-Min:

    0.8 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver (Sn/Ag)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    11 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

MIMX9301CVVXDAB Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout guide in the MIMX9301CVVXDAB application note (AN12144) which includes thermal design considerations, such as thermal vias, copper pours, and component placement.
  • To optimize power consumption, use the low-power modes (e.g., sleep, deep sleep) and adjust the clock frequency according to the system requirements. Additionally, use the power gating feature to turn off unused peripherals and reduce leakage current.
  • The MIMX9301CVVXDAB is rated for operation from -40°C to 125°C (junction temperature), but the recommended operating temperature range is -20°C to 105°C for optimal performance and reliability.
  • Follow the EMC guidelines in the MIMX9301CVVXDAB datasheet and application notes, including proper PCB layout, component selection, and shielding. Additionally, perform EMC testing and certification according to relevant industry standards (e.g., IEC 61000-4-2).
  • NXP recommends using 100 nF to 1 μF decoupling capacitors with a voltage rating of 2.5 V or higher, placed as close as possible to the power pins of the MIMX9301CVVXDAB. The exact value and type of capacitor may vary depending on the specific application and PCB design.

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MIMX9301CVVXDAB Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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