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MIMX9322CVXXMAB - NXP

Description: MX 93 Applications Processor Family – Arm® Cortex®-A55, ML Acceleration, Power Efficient MPU,

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MIMX9322CVXXMAB - NXP PCB footprint - BGA - BGA - SOT2175-1_2025-1
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MIMX9322CVXXMAB - NXP  - 3D model - BGA - SOT2175-1_2025-1
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MIMX9322CVXXMAB Details

  • Manufacturer Part Number:

    MIMX9322CVXXMAB

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    FCBGA-208

  • Country Of Origin:

    South Korea, Taiwan

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    3

  • JESD-30 Code:

    S-PBGA-B208

  • Length:

    9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    208

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA208,17X17,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max:

    0.9 V

  • Supply Voltage-Min:

    0.8 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Bismuth (Sn/Bi)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    9 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

MIMX9322CVXXMAB Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout guide in the MIMX9322CVXXMAB application note (AN12144) which includes guidelines for component placement, routing, and thermal management.
  • To optimize power consumption, use the low-power modes (e.g., sleep, deep sleep) and adjust the clock frequency according to the system requirements. Additionally, use the power gating feature to turn off unused peripherals and reduce leakage current.
  • The MIMX9322CVXXMAB has an operating temperature range of -40°C to 105°C, but it's recommended to operate within the -20°C to 85°C range for optimal performance and reliability.
  • Follow the EMC guidelines in the MIMX9322CVXXMAB application note (AN12144) and use proper shielding, grounding, and filtering techniques to minimize electromagnetic interference (EMI) and ensure compliance with regulatory standards.
  • NXP recommends using a 32.768 kHz crystal oscillator with a load capacitance of 10 pF to 20 pF and a series resistance of 500 ohms to 1000 ohms for optimal performance and stability.

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MIMX9322CVXXMAB Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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