MIMX9331XVVXMAB - NXP

MIMX9331XVVXMAB Details

• Manufacturer Part Number:

  MIMX9331XVVXMAB

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  FCBGA-306

• Country Of Origin:

  South Korea, Taiwan

• HTS Code:

  8542.31.00.30

• Factory Lead Time:

  26 Weeks

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  12

• JESD-30 Code:

  S-PBGA-B306

• Length:

  11 mm

• Moisture Sensitivity Level:

  3

• Number of Terminals:

  306

• Operating Temperature-Max:

  125 °C

• Operating Temperature-Min:

  -40 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  LFBGA

• Package Equivalence Code:

  BGA306,21X21,20

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, LOW PROFILE, FINE PITCH

• Peak Reflow Temperature (Cel):

  260

• Seated Height-Max:

  1.22 mm

• Supply Voltage-Max:

  0.9 V

• Supply Voltage-Min:

  0.8 V

• Supply Voltage-Nom:

  0.85 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Terminal Finish:

  Tin/Silver (Sn/Ag)

• Terminal Form:

  BALL

• Terminal Pitch:

  0.5 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  40

• Width:

  11 mm

• uPs/uCs/Peripheral ICs Type:

  SoC