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MIMX9332CVVXMAB - NXP

Description: Processors - Application Specialized i.MX93 BGA11

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MIMX9332CVVXMAB - NXP - PCB symbol
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PCB Footprints
MIMX9332CVVXMAB - NXP PCB footprint - BGA - BGA - 11mm x 11mm x 0.5mm Pitch
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3D Models
MIMX9332CVVXMAB - NXP - 3D model - BGA - 11mm x 11mm x 0.5mm Pitch
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MIMX9332CVVXMAB Details

  • Manufacturer Part Number:

    MIMX9332CVVXMAB

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCBGA-306

  • Country Of Origin:

    South Korea, Taiwan

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    12

  • JESD-30 Code:

    S-PBGA-B306

  • JESD-609 Code:

    e2

  • Length:

    11 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    306

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA306,21X21,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.22 mm

  • Supply Voltage-Max:

    0.9 V

  • Supply Voltage-Min:

    0.8 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver (Sn/Ag)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    11 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

MIMX9332CVVXMAB Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout and thermal management guide in the MIMX9332CVVXMAB application note (AN12115). It's essential to follow these guidelines to ensure proper heat dissipation and signal integrity.
  • To optimize power consumption, use the low-power modes (e.g., sleep, deep sleep) and adjust the clock frequency according to your application's requirements. Additionally, use the power gating feature to turn off unused peripherals and modules.
  • The MIMX9332CVVXMAB is rated for operation between -40°C to 105°C (ambient temperature). However, it's essential to consider the junction temperature (Tj) when designing your system, as it can affect the device's reliability and performance.
  • NXP provides a secure boot and firmware update solution using the Bootloader and Secure Firmware Update (SFWU) features. Refer to the MIMX9332CVVXMAB security documentation and application notes for implementation details.
  • NXP recommends using a high-quality external oscillator (e.g., crystal or ceramic resonator) or a clock generator module (e.g., NXP's PCA9410) to ensure reliable and accurate clocking. The internal RC oscillator can be used as a fallback or for low-power modes.

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MIMX9332CVVXMAB Overview

Use the download button to access the MIMX9332CVVXMAB schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MIMX9, or try a keyword search, such as Other uPs/uCs/Peripheral ICs

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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