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MIMX9332XVVXMAB - NXP

Description: Processors - Application Specialized i.MX93 BGA11

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MIMX9332XVVXMAB Details

  • Manufacturer Part Number:

    MIMX9332XVVXMAB

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCBGA-306

  • Country Of Origin:

    South Korea, Taiwan

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    12

  • JESD-30 Code:

    S-PBGA-B306

  • Length:

    11 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    306

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA306,21X21,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.22 mm

  • Supply Voltage-Max:

    0.9 V

  • Supply Voltage-Min:

    0.8 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver (Sn/Ag)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    11 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

MIMX9332XVVXMAB Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout guide for the MIMX9332XVVXMAB in the application note AN12271, which includes guidelines for thermal vias, heat sinks, and PCB layer stackup to ensure optimal thermal performance.
  • To optimize power consumption in low-power modes, engineers can use the device's power gating features, clock gating, and dynamic voltage and frequency scaling. Additionally, NXP provides a power consumption calculator tool to help estimate power consumption in different modes.
  • The recommended settings for the internal voltage regulators can be found in the device's datasheet and application notes. NXP also provides a voltage regulator configuration tool to help engineers optimize the settings for their specific application.
  • To ensure reliable boot-up and secure boot mechanisms, engineers can use the device's built-in boot ROM and secure boot features, such as encrypted boot images and secure key storage. NXP provides guidelines and tools for implementing secure boot mechanisms in the device's documentation and application notes.
  • The thermal limitations and derating factors for the MIMX9332XVVXMAB can be found in the device's datasheet and thermal application notes. NXP provides thermal models and simulation tools to help engineers estimate the device's thermal performance and derating factors for their specific application.

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MIMX9332XVVXMAB Overview

Use the download button to access the MIMX9332XVVXMAB 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like MIMX9, or try a keyword search, such as Other uPs/uCs/Peripheral ICs

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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