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MIMXRT1051CVJ5B - NXP

Description: SOC ARM Cortex M7 40nm 196-Pin LFBGA Tray

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MIMXRT1051CVJ5B - NXP - PCB symbol
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MIMXRT1051CVJ5B - NXP PCB footprint - BGA - BGA - LFBGA
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MIMXRT1051CVJ5B - NXP - 3D model - BGA - LFBGA
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MIMXRT1051CVJ5B Details

  • Manufacturer Part Number:

    MIMXRT1051CVJ5B

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MABGA-196

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    13 Weeks

  • Date Of Intro:

    2018-09-12

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    6

  • JESD-30 Code:

    S-PBGA-B196

  • JESD-609 Code:

    e2

  • Length:

    12 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    196

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA196,14X14,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.52 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.15 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver (Sn/Ag)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    12 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

MIMXRT1051CVJ5B Frequently Asked Questions (FAQs)

  • The recommended PCB layout for the MIMXRT1051CVJ5B is to place the device in a well-ventilated area, away from any heat sources. The device should be mounted on a thermal pad to ensure proper heat dissipation. Additionally, the PCB should be designed to minimize electromagnetic interference (EMI) and radio-frequency interference (RFI).
  • To configure the MIMXRT1051CVJ5B for low-power mode, set the PWR_MGMT_CTRL register to 0x01. This will enable the low-power mode and reduce the device's power consumption. Additionally, you can also set the CPU frequency to a lower value to further reduce power consumption.
  • The recommended way to update the MIMXRT1051CVJ5B's firmware is to use the NXP-provided SDK and follow the instructions provided in the SDK documentation. Make sure to backup your data before updating the firmware, and ensure that the device is properly configured for the update process.
  • To troubleshoot issues with the MIMXRT1051CVJ5B's communication interfaces, start by checking the device's configuration and settings. Verify that the communication interfaces are properly configured and enabled. If the issue persists, try resetting the device or re-flashing the firmware. If the issue still persists, contact NXP support for further assistance.
  • Some common pitfalls to avoid when designing a PCB for the MIMXRT1051CVJ5B include: not providing sufficient decoupling capacitance, not using a thermal pad, and not properly routing the device's power and ground lines. Make sure to follow the recommended PCB layout guidelines provided in the datasheet and consult with NXP support if you have any questions or concerns.

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MIMXRT1051CVJ5B Overview

Use the download button to access the MIMXRT1051CVJ5B schematic symbol, PCB footprint, and 3D model.
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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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