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MIMXRT105SDVL6B - NXP

Description: ARM Microcontrollers - MCU i.MXRT105A

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Symbol
MIMXRT105SDVL6B - NXP - PCB symbol
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PCB Footprints
MIMXRT105SDVL6B - NXP PCB footprint - BGA - BGA - SOT1546-2
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3D Models
MIMXRT105SDVL6B - NXP - 3D model - BGA - SOT1546-2
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MIMXRT105SDVL6B Details

  • Manufacturer Part Number:

    MIMXRT105SDVL6B

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MAPBGA-196

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    6

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    24 MHz

  • Format:

    FLOATING-POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PBGA-B196

  • Length:

    10 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    32

  • Number of Serial I/Os:

    29

  • Number of Terminals:

    196

  • On Chip Data RAM Width:

    8

  • Operating Temperature-Max:

    95 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA196,14X14,25

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • RAM (words):

    524288

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.43 mm

  • Speed:

    600 MHz

  • Supply Current-Max:

    105 mA

  • Supply Voltage-Max:

    1.3 V

  • Supply Voltage-Min:

    1.25 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    10 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

MIMXRT105SDVL6B Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the MIMXRT105SDVL6B is -40°C to 105°C, as specified in the datasheet. However, it's recommended to operate the device within the industrial temperature range of -40°C to 85°C for optimal performance and reliability.
  • The clock settings for the MIMXRT105SDVL6B can be configured using the Clock Control Module (CCM) registers. The CCM module allows you to configure the clock sources, dividers, and multiplexers to generate the desired clock frequencies for the various peripherals and domains. Refer to the device's reference manual for detailed information on clock configuration.
  • The maximum frequency for the MIMXRT105SDVL6B's Cortex-M7 core is 528 MHz. However, the actual operating frequency may be limited by the clock configuration, voltage, and temperature.
  • The FlexSPI interface on the MIMXRT105SDVL6B is a flexible serial peripheral interface that can be configured to interface with various types of serial flash memories. To use the FlexSPI interface, you need to configure the FlexSPI module registers to set the clock frequency, bus width, and other parameters. You also need to implement the necessary software drivers to communicate with the external flash memory.
  • The power consumption of the MIMXRT105SDVL6B depends on the operating frequency, voltage, and peripheral usage. According to the datasheet, the typical power consumption of the device is around 250 mW at 528 MHz and 1.2 V. However, the actual power consumption may vary depending on the specific application and usage scenario.

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MIMXRT105SDVL6B Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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