MIMXRT1062DVJ6B - NXP

MIMXRT1062DVJ6B Details

• Manufacturer Part Number:

  MIMXRT1062DVJ6B

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Country Of Origin:

  Mainland China

• ECCN Code:

  5A992.C

• HTS Code:

  8542.31.00.30

• Factory Lead Time:

  18 Weeks

• Date Of Intro:

  2020-08-07

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  7

• JESD-30 Code:

  S-PBGA-B196

• JESD-609 Code:

  e2

• Length:

  12 mm

• Moisture Sensitivity Level:

  3

• Number of Terminals:

  196

• Operating Temperature-Max:

  95 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  LFBGA

• Package Equivalence Code:

  BGA196,14X14,32

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, LOW PROFILE, FINE PITCH

• Peak Reflow Temperature (Cel):

  260

• Seated Height-Max:

  1.52 mm

• Supply Voltage-Max:

  1.3 V

• Supply Voltage-Min:

  1.15 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Terminal Finish:

  Tin/Silver (Sn/Ag)

• Terminal Form:

  BALL

• Terminal Pitch:

  0.8 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  40

• Width:

  12 mm

• uPs/uCs/Peripheral ICs Type:

  SoC