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MIMXRT1171AVM8A - NXP

Description: SOC i.MX ARM Cortex M7 289-Pin MAP-BGA Tray

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PCB Footprints
MIMXRT1171AVM8A - NXP PCB footprint - BGA - BGA - LFBGA289, plastic, low profile fine-pitch ball grid array; 289 balls; 0.8 mm pitch; 14 mm x 14 mm x 1.37
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3D Models
MIMXRT1171AVM8A - NXP  - 3D model - BGA - LFBGA289, plastic, low profile fine-pitch ball grid array; 289 balls; 0.8 mm pitch; 14 mm x 14 mm x 1.37
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  • Datasheet Download Datasheet
  • Stock & Prices $ Price & Stock for MIMXRT1171AVM8A
  • Part Number MIMXRT1171AVM8A
  • Manufacturer NXP
  • Pin Count 289
  • Part Category Integrated Circuit
  • Package Category BGA
  • Footprint Name BGA - LFBGA289, plastic, low profile fine-pitch ball grid array; 289 balls; 0.8 mm pitch; 14 mm x 14 mm x 1.37
  • Released Date Apr 13, 2021
  • Last Modified Date Mar 7, 2023 4:10 PM UTC
  • Pinout / Pin List Click Here (Member Only)

MIMXRT1171AVM8A Details

  • Manufacturer Part Number:

    MIMXRT1171AVM8A

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    10

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    48 MHz

  • Format:

    FLOATING-POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PBGA-B289

  • Length:

    14 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    32

  • Number of Serial I/Os:

    1

  • Number of Terminals:

    289

  • On Chip Data RAM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA289,17X17,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • RAM (words):

    2097152

  • Seated Height-Max:

    1.52 mm

  • Speed:

    800 MHz

  • Supply Current-Max:

    850 mA

  • Supply Voltage-Max:

    1.95 V

  • Supply Voltage-Min:

    1.71 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin/Silver (Sn/Ag)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    14 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

MIMXRT1171AVM8A Frequently Asked Questions (FAQs)

  • The MIMXRT1171AVM8A can operate from -40°C to 105°C, but the recommended operating temperature range is -20°C to 85°C for optimal performance and reliability.
  • The clock system on the MIMXRT1171AVM8A can be configured using the Clock Control Module (CCM) registers. The CCM provides a flexible clocking system that allows you to configure the clock sources, dividers, and multiplexers to generate the desired clock frequencies for the various peripherals and domains.
  • The maximum frequency of the CPU on the MIMXRT1171AVM8A is 1 GHz, but it can be dynamically adjusted using the Adaptive Frequency Scaling (AFS) feature to optimize power consumption and performance.
  • The FlexSPI interface on the MIMXRT1171AVM8A is a flexible serial peripheral interface that can be used to connect to external serial flash memories, displays, and other devices. It can be configured using the FlexSPI registers and can operate in various modes, including SPI, Quad SPI, and Octal SPI.
  • The TrustZone-M security feature on the MIMXRT1171AVM8A is a security extension that provides an additional layer of protection for sensitive code and data. It allows developers to isolate sensitive code and data in a secure environment, protecting it from unauthorized access and tampering.

Trust Checks

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MIMXRT1171AVM8A Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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