- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for MJ4502
- Part Number MJ4502
- Manufacturer onsemi
- Pin Count 4
- Part Category Transistor BJT PNP
- Package Category Other
- Footprint Name Other - MJ4502-3
- Released Date Oct 31, 2019
- Last Modified Date Mar 7, 2023 4:10 PM UTC
- Pinout / Pin List Click Here (Member Only)
MJ4502 Details
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Manufacturer Part Number:
MJ4502
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Part Life Cycle Code:
Obsolete
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Part Package Code:
TO-204AA
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Package Description:
CASE 1-07, TO-204AA, 2 PIN
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Pin Count:
2
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Manufacturer Package Code:
CASE 1-07
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ECCN Code:
EAR99
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Manufacturer:
onsemi
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YTEOL:
0
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Case Connection:
COLLECTOR
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Collector Current-Max (IC):
30 A
MJ4502 Frequently Asked Questions (FAQs)
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The maximum safe operating area (SOA) for the MJ4502 is not explicitly stated in the datasheet, but it can be estimated based on the device's thermal and electrical characteristics. A general rule of thumb is to limit the device to a maximum power dissipation of 100W, with a maximum current of 15A and a maximum voltage of 200V.
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To ensure reliable operation of the MJ4502 in high-temperature environments, it is essential to provide adequate heat sinking and thermal management. The device's junction temperature (Tj) should be kept below 150°C, and the case temperature (Tc) should be kept below 100°C. Additionally, the device should be operated within its recommended voltage and current ratings.
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The recommended storage temperature range for the MJ4502 is -55°C to 150°C. Storage outside of this range may affect the device's reliability and performance.
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Yes, the MJ4502 can be used in switching applications, but it is not optimized for high-frequency switching. The device's switching characteristics, such as its rise and fall times, are not specified in the datasheet. However, the device's low saturation voltage and high current gain make it suitable for low-frequency switching applications.
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Thermal runaway in the MJ4502 can be prevented by ensuring that the device is operated within its recommended voltage and current ratings, and that adequate heat sinking and thermal management are provided. Additionally, the device's thermal resistance (Rth) should be minimized by using a heat sink with a low thermal resistance, and by ensuring good thermal contact between the device and the heat sink.
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MJ4502 Overview
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