MK26FN2M0CAC18R - NXP

MK26FN2M0CAC18R Details

• Manufacturer Part Number:

  MK26FN2M0CAC18R

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  WLCSP-169

• ECCN Code:

  3A991.A.2

• HTS Code:

  8542.31.00.25

• Factory Lead Time:

  26 Weeks

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  10

• Has ADC:

  YES

• Bit Size:

  32

• CPU Family:

  CORTEX-M4F

• Clock Frequency-Max:

  50 MHz

• DAC Channels:

  YES

• DMA Channels:

  YES

• JESD-30 Code:

  R-PBGA-B169

• Length:

  5.6 mm

• Moisture Sensitivity Level:

  1

• Number of I/O Lines:

  116

• Number of Terminals:

  169

• On Chip Program ROM Width:

  8

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• PWM Channels:

  YES

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  FBGA

• Package Equivalence Code:

  BGA169,13X13,16

• Package Shape:

  RECTANGULAR

• Package Style:

  GRID ARRAY, FINE PITCH

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• RAM (bytes):

  262144

• ROM (words):

  2097152

• ROM Programmability:

  FLASH

• Speed:

  180 MHz

• Supply Current-Max:

  106.75 mA

• Supply Voltage-Max:

  3.6 V

• Supply Voltage-Min:

  3.3 V

• Supply Voltage-Nom:

  3.3 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Form:

  BALL

• Terminal Pitch:

  0.4 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  40

• Width:

  5.5 mm

• uPs/uCs/Peripheral ICs Type:

  MICROCONTROLLER, RISC