MK53DN512ZCMD10 - NXP

MK53DN512ZCMD10 Details

• Manufacturer Part Number:

  MK53DN512ZCMD10

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Not Recommended

• Package Description:

  13 X 13 MM, MAPBGA-144

• Country Of Origin:

  Mainland China, Malaysia

• ECCN Code:

  3A991.A.2

• HTS Code:

  8542.31.00.25

• Factory Lead Time:

  13 Weeks

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  10

• Has ADC:

  YES

• Bit Size:

  32

• Boundary Scan:

  YES

• Clock Frequency-Max:

  32 MHz

• DAC Channels:

  YES

• DMA Channels:

  YES

• JESD-30 Code:

  S-PBGA-B144

• JESD-609 Code:

  e1

• Length:

  13 mm

• Moisture Sensitivity Level:

  3

• Number of I/O Lines:

  104

• Number of Terminals:

  144

• On Chip Program ROM Width:

  8

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• PWM Channels:

  YES

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  LFBGA

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, LOW PROFILE, FINE PITCH

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• ROM (words):

  524288

• ROM Programmability:

  FLASH

• Seated Height-Max:

  1.7 mm

• Speed:

  100 MHz

• Supply Voltage-Max:

  3.6 V

• Supply Voltage-Min:

  1.71 V

• Supply Voltage-Nom:

  3.3 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  Nickel/Gold (Ni/Au)

• Terminal Form:

  BALL

• Terminal Pitch:

  0.5 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  40

• Width:

  13 mm

• uPs/uCs/Peripheral ICs Type:

  MICROCONTROLLER, RISC