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MLF1608DR27JT000 - TDK

Description: SMD / SMT Inductors (Coils), L=0.27?H, L x W x T :

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PCB Footprints
MLF1608DR27JT000 - TDK PCB footprint - Inductors Chip - Inductors Chip - SIZE CODE 1608_A
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3D Models
MLF1608DR27JT000 - TDK  - 3D model - Inductors Chip - SIZE CODE 1608_A
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MLF1608DR27JT000 Details

  • Manufacturer Part Number:

    MLF1608DR27JT000

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    7.1

  • Case/Size Code:

    0603

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.6 Ω

  • Inductance-Nom (L):

    0.27 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.8 mm

  • Package Length:

    1.6 mm

  • Package Style:

    SMT

  • Package Width:

    0.8 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    15

  • Rated Current-Max:

    0.15 A

  • Self Resonance Frequency:

    260 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    25 MHz

  • Tolerance:

    5%

MLF1608DR27JT000 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MLF1608DR27JT000 is available in the TDK Corporation's recommended footprint document, which can be found on their website. The document provides detailed information on the recommended pad layout, solder mask, and solder fillet dimensions.
  • To prevent damage during assembly, it is recommended to handle the MLF1608DR27JT000 by the edges, avoiding touching the pads or the component body. It is also recommended to use anti-static wrist straps, mats, or other ESD protection devices to prevent electrostatic discharge damage.
  • The maximum reflow temperature for MLF1608DR27JT000 is 260°C, as specified in the datasheet. However, it is recommended to follow the recommended reflow profile provided by TDK Corporation to ensure reliable soldering and to prevent damage to the component.
  • The MLF1608DR27JT000 is designed to withstand moderate vibration levels, but it is not recommended for use in high-vibration environments. If your application requires high vibration resistance, it is recommended to consult with TDK Corporation or consider using a different component that is specifically designed for high-vibration applications.
  • The equivalent series resistance (ESR) of MLF1608DR27JT000 is not explicitly stated in the datasheet, but it can be calculated using the impedance vs. frequency graph provided in the datasheet. Alternatively, you can contact TDK Corporation's technical support for more information on how to determine the ESR.

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MLF1608DR27JT000 Overview

Use the download button to access the MLF1608DR27JT000 schematic symbol, PCB footprint, and 3D model.
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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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Part Image MLF1608DR27JTD25 TDK Corporation

General Purpose Inductor, 0.27uH, 5%, 1 Element, Ferrite-Core, SMD, 0603

Part Image MLF1608DR27JT TDK Corporation

General Purpose Inductor, 0.27uH, 5%, 1 Element, Ferrite-Core, SMD, 0603