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MLF2012A1R5KT000 - TDK

Description: SMD / SMT Inductors (Coils), L=1.5?H, L x W x T :

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PCB Footprints
MLF2012A1R5KT000 - TDK PCB footprint - Inductors Chip - Inductors Chip - MLF2012(0.85T)
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3D Models
MLF2012A1R5KT000 - TDK  - 3D model - Inductors Chip - MLF2012(0.85T)
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MLF2012A1R5KT000 Details

  • Manufacturer Part Number:

    MLF2012A1R5KT000

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    5.7

  • Case/Size Code:

    0805

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.4 Ω

  • Inductance-Nom (L):

    1.5 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e2

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.85 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    45

  • Rated Current-Max:

    0.08 A

  • Self Resonance Frequency:

    100 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN NICKEL COPPER

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    10 MHz

  • Tolerance:

    10%

MLF2012A1R5KT000 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MLF2012A1R5KT000 is available in the TDK Corporation's recommended footprint document, which can be found on their website. The document provides detailed information on the recommended pad size, shape, and spacing for optimal performance and reliability.
  • Thermal management is critical for MLF2012A1R5KT000, as excessive heat can affect its performance and reliability. It is recommended to use a thermal pad or a heat sink to dissipate heat away from the component. Additionally, ensure good airflow around the component and avoid blocking the airflow with other components or obstacles.
  • The maximum operating temperature range for MLF2012A1R5KT000 is -55°C to +125°C, as specified in the datasheet. However, it is recommended to operate the component within a narrower temperature range of -40°C to +85°C for optimal performance and reliability.
  • Yes, MLF2012A1R5KT000 is designed to withstand high-vibration environments. However, it is recommended to follow the recommended mounting and soldering procedures to ensure the component is securely attached to the PCB. Additionally, consider using a vibration-dampening material or a mechanical fixture to further reduce the impact of vibrations.
  • To ensure the reliability of MLF2012A1R5KT000 in a humid environment, it is recommended to use a conformal coating or a moisture-resistant material to protect the component from moisture ingress. Additionally, ensure good airflow around the component and avoid exposing it to extreme humidity conditions.

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MLF2012A1R5KT000 Overview

Use the download button to access the MLF2012A1R5KT000 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MLF20, or try a keyword search, such as Fixed Inductors

About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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