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MLF2012A4R7MT000 - TDK

Description: SMD / SMT Inductors (Coils), L=4.7?H, L x W x T :

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PCB Footprints
MLF2012A4R7MT000 - TDK PCB footprint - Inductors Chip - Inductors Chip - MLF2012(1.25T)
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3D Models
MLF2012A4R7MT000 - TDK  - 3D model - Inductors Chip - MLF2012(1.25T)
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MLF2012A4R7MT000 Details

  • Manufacturer Part Number:

    MLF2012A4R7MT000

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    5.7

  • Case/Size Code:

    0805

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.7 Ω

  • Inductance-Nom (L):

    4.7 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    1.25 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    45

  • Rated Current-Max:

    0.03 A

  • Self Resonance Frequency:

    50 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    10 MHz

  • Tolerance:

    20%

MLF2012A4R7MT000 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MLF2012A4R7MT000 is available in the TDK Corporation's recommended footprint document, which can be found on their website. The document provides detailed information on the recommended pad layout, solder mask, and solder fillet dimensions.
  • To prevent damage, it is recommended to handle the MLF2012A4R7MT000 by the edges, avoiding touching the pads or the component body. It is also recommended to use anti-static wrist straps, mats, or other ESD protection devices to prevent electrostatic discharge damage.
  • The maximum reflow temperature for MLF2012A4R7MT000 is 260°C, as specified in the datasheet. However, it is recommended to follow the recommended reflow profile provided by TDK Corporation to ensure reliable soldering and to prevent damage to the component.
  • The MLF2012A4R7MT000 is designed to withstand normal vibration levels, but it may not be suitable for high-vibration environments. If you need to use the component in a high-vibration environment, it is recommended to consult with TDK Corporation's application engineers to determine the suitability of the component and to discuss possible customization options.
  • The equivalent series resistance (ESR) of the MLF2012A4R7MT000 is not explicitly stated in the datasheet, but it can be calculated using the impedance vs. frequency graph provided in the datasheet. Alternatively, you can contact TDK Corporation's application engineers for more information on how to determine the ESR.

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MLF2012A4R7MT000 Overview

Use the download button to access the MLF2012A4R7MT000 schematic symbol, PCB footprint, and 3D model.
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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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Part Image MLF2012A4R7MTD25 TDK Corporation

General Purpose Inductor, 4.7uH, 20%, 1 Element, Ferrite-Core, SMD, 0805