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MLF2012DR10K - TDK

Description: TDK 100 nH ±10% Ferrite Multilayer SMD Inductor, 0805 Case, SRF: 0.5GHz Q: 20 300mA dc 150mΩ Rdc

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PCB Footprints
MLF2012DR10K - TDK PCB footprint - Inductors Chip - Inductors Chip - 0805
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3D Models
MLF2012DR10K - TDK  - 3D model - Inductors Chip - 0805
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MLF2012DR10K Details

  • Manufacturer Part Number:

    MLF2012DR10K

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active Unconfirmed

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    2

  • Core Material:

    FERRITE

  • DC Resistance:

    0.3 Ω

  • Inductance-Nom (L):

    0.1 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -25 °C

  • Quality Factor-Min (at L-nom):

    20

  • Rated Current-Max:

    0.25 A

  • Self Resonance Frequency:

    235 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Special Feature:

    MULTILAYER

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    25 MHz

  • Tolerance:

    10%

MLF2012DR10K Frequently Asked Questions (FAQs)

  • The recommended land pattern for MLF2012DR10K is a rectangular pad with a size of 1.2mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask opening of 0.5mm x 0.5mm.
  • To handle thermal considerations for MLF2012DR10K, ensure that the component is placed on a thermal land with a sufficient copper area to dissipate heat. A thermal via or thermal pad can also be used to improve heat dissipation. Additionally, consider using a thermal interface material (TIM) to reduce thermal resistance.
  • The maximum operating temperature range for MLF2012DR10K is -55°C to +125°C. However, the component's performance and reliability may degrade at extreme temperatures, so it's recommended to operate within the recommended temperature range of -40°C to +85°C.
  • To ensure the reliability of MLF2012DR10K in high-vibration environments, use a robust mounting method such as underfill or potting to secure the component. Additionally, consider using a vibration-resistant adhesive or conformal coating to prevent component detachment or damage.
  • The recommended storage condition for MLF2012DR10K is in a dry, cool place with a temperature range of 5°C to 30°C and humidity below 60%. Avoid storing the component in direct sunlight, high humidity, or extreme temperatures.

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MLF2012DR10K Overview

Use the download button to access the MLF2012DR10K schematic symbol, PCB footprint, and 3D model.
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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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