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MLF2012DR12JTD25 - TDK

Description: SMD / SMT Inductors (Coils), L=0.12?H, L x W x T :

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PCB Footprints
MLF2012DR12JTD25 - TDK PCB footprint - Inductors Chip - Inductors Chip - MLF2012(0.85T)
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3D Models
MLF2012DR12JTD25 - TDK  - 3D model - Inductors Chip - MLF2012(0.85T)
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MLF2012DR12JTD25 Details

  • Manufacturer Part Number:

    MLF2012DR12JTD25

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    7.6

  • Case/Size Code:

    0805

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.2 Ω

  • Inductance-Nom (L):

    0.12 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.85 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    20

  • Rated Current-Max:

    0.3 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    360 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    25 MHz

  • Tolerance:

    5%

MLF2012DR12JTD25 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MLF2012DR12JTD25 is available in the TDK Corporation's application note or can be found in the IPC-7351 standard. It is essential to follow the recommended land pattern to ensure reliable soldering and to prevent defects.
  • To prevent damage, it is recommended to handle the MLF2012DR12JTD25 by the edges, avoid touching the pads, and use anti-static wrist straps or mats to prevent electrostatic discharge. Additionally, the component should be stored in a dry, cool place, away from direct sunlight.
  • The maximum reflow temperature for MLF2012DR12JTD25 is 260°C, as specified in the datasheet. Exceeding this temperature can cause damage to the component or affect its reliability.
  • While the MLF2012DR12JTD25 is a robust component, it is still susceptible to vibration. To ensure reliability, it is recommended to follow the recommended mounting and soldering guidelines, and to consider additional mechanical support or potting compounds in high-vibration environments.
  • To troubleshoot issues with MLF2012DR12JTD25, start by checking the soldering quality, ensuring that the component is properly seated and soldered. Then, verify the circuit design and layout, checking for any potential electrical or thermal issues. If the problem persists, consult the datasheet or contact TDK Corporation's technical support for further assistance.

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MLF2012DR12JTD25 Overview

Use the download button to access the MLF2012DR12JTD25 schematic symbol, PCB footprint, and 3D model.
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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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