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MLF2012DR12MTD25 - TDK

Description: SMD / SMT Inductors (Coils), L=0.12?H, L x W x T :

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Symbol
MLF2012DR12MTD25 - TDK - PCB symbol
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PCB Footprints
MLF2012DR12MTD25 - TDK PCB footprint - Inductors Chip - Inductors Chip - MLF2012(0.85T)
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3D Models
MLF2012DR12MTD25 - TDK - 3D model - Inductors Chip - MLF2012(0.85T)
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MLF2012DR12MTD25 Details

  • Manufacturer Part Number:

    MLF2012DR12MTD25

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    7.6

  • Case/Size Code:

    0805

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.2 Ω

  • Inductance-Nom (L):

    0.12 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.85 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    20

  • Rated Current-Max:

    0.3 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    360 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    25 MHz

  • Tolerance:

    20%

MLF2012DR12MTD25 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MLF2012DR12MTD25 is a rectangular pad with a size of 1.2mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • To handle thermal considerations, ensure that the component is placed on a thermal land with a sufficient copper area to dissipate heat. A thermal via can also be used to improve heat dissipation. Additionally, consider using a thermal interface material (TIM) to reduce thermal resistance between the component and the PCB.
  • The maximum reflow temperature for MLF2012DR12MTD25 is 260°C, with a peak temperature of 250°C for a maximum of 10 seconds. It's essential to follow the recommended reflow profile to prevent damage to the component.
  • While MLF2012DR12MTD25 is a robust component, it's essential to consider the vibration environment and ensure that the component is properly secured to the PCB using a suitable adhesive or mechanical fastening method. Additionally, consider using a vibration-dampening material to reduce the impact of vibrations on the component.
  • To ensure reliability in a humid environment, consider applying a conformal coating to the PCB to prevent moisture ingress. Additionally, ensure that the component is stored in a dry environment before assembly, and follow the recommended handling and storage procedures.

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MLF2012DR12MTD25 Overview

Use the download button to access the MLF2012DR12MTD25 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MLF20, or try a keyword search, such as Fixed Inductors

About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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