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MLF2012DR18JTD25 - TDK

Description: SMD / SMT Inductors (Coils), L=0.18?H, L x W x T :

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Symbol
MLF2012DR18JTD25 - TDK - PCB symbol
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PCB Footprints
MLF2012DR18JTD25 - TDK PCB footprint - Inductors Chip - Inductors Chip - MLF2012(0.85T)
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3D Models
MLF2012DR18JTD25 - TDK - 3D model - Inductors Chip - MLF2012(0.85T)
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MLF2012DR18JTD25 Details

  • Manufacturer Part Number:

    MLF2012DR18JTD25

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    7.1

  • Case/Size Code:

    0805

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.25 Ω

  • Inductance-Nom (L):

    0.18 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.85 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    20

  • Rated Current-Max:

    0.3 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    280 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    25 MHz

  • Tolerance:

    5%

MLF2012DR18JTD25 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MLF2012DR18JTD25 is available in the TDK Corporation's application note or can be found in the IPC-7351 standard. It is essential to follow the recommended land pattern to ensure reliable soldering and to prevent defects.
  • To prevent damage, it is recommended to handle the MLF2012DR18JTD25 by the edges, avoiding touching the pads or the component body. It is also essential to use anti-static wrist straps, mats, or other ESD protection devices to prevent electrostatic discharge damage.
  • The maximum reflow temperature for MLF2012DR18JTD25 is 260°C, as specified in the datasheet. Exceeding this temperature can cause damage to the component or affect its reliability.
  • Yes, MLF2012DR18JTD25 is designed to withstand high-vibration applications. However, it is essential to ensure that the component is properly soldered and secured to the PCB to prevent mechanical stress or damage.
  • The equivalent series resistance (ESR) of MLF2012DR18JTD25 can be determined by measuring the impedance of the component using an impedance analyzer or a network analyzer. The ESR value can also be calculated using the component's datasheet parameters, such as the capacitance and the dissipation factor.

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MLF2012DR18JTD25 Overview

Use the download button to access the MLF2012DR18JTD25 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MLF20, or try a keyword search, such as Fixed Inductors

About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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