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MLF2012DR22JT000 - TDK

Description: SMD / SMT Inductors (Coils), L=0.22?H, L x W x T :

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Symbol
MLF2012DR22JT000 - TDK - PCB symbol
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PCB Footprints
MLF2012DR22JT000 - TDK PCB footprint - Inductors Chip - Inductors Chip - MLF2012(0.85T)
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3D Models
MLF2012DR22JT000 - TDK - 3D model - Inductors Chip - MLF2012(0.85T)
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MLF2012DR22JT000 Details

  • Manufacturer Part Number:

    MLF2012DR22JT000

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    7.1

  • Case/Size Code:

    0805

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.3 Ω

  • Inductance-Nom (L):

    0.22 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.85 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    20

  • Rated Current-Max:

    0.25 A

  • Self Resonance Frequency:

    250 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    25 MHz

  • Tolerance:

    5%

MLF2012DR22JT000 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MLF2012DR22JT000 is a rectangular pad with a size of 1.2mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • To handle thermal considerations for MLF2012DR22JT000, ensure that the component is placed on a thermal pad or a copper pour on the PCB to dissipate heat efficiently. The thermal pad should be connected to a ground plane or a heat sink to further improve heat dissipation.
  • The maximum operating temperature for MLF2012DR22JT000 is 125°C, as specified in the datasheet. However, it's recommended to derate the component's power rating according to the temperature derating curve provided in the datasheet to ensure reliable operation.
  • Yes, MLF2012DR22JT000 is designed to withstand vibrations and can be used in high-vibration environments. However, it's essential to ensure that the component is properly soldered and secured to the PCB to prevent mechanical stress and damage.
  • To select the right capacitor value for your application, consider the operating frequency, voltage, and current requirements. Consult the datasheet and application notes provided by TDK Corporation for guidance on selecting the appropriate capacitor value for your specific use case.

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MLF2012DR22JT000 Overview

Use the download button to access the MLF2012DR22JT000 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MLF20, or try a keyword search, such as Fixed Inductors

About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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