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MLF2012DR27KT000 - TDK

Description: SMD / SMT Inductors (Coils), L=0.27?H, L x W x T :

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PCB Footprints
MLF2012DR27KT000 - TDK PCB footprint - Inductors Chip - Inductors Chip - MLF2012(0.85T)
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3D Models
MLF2012DR27KT000 - TDK  - 3D model - Inductors Chip - MLF2012(0.85T)
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MLF2012DR27KT000 Details

  • Manufacturer Part Number:

    MLF2012DR27KT000

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    7.1

  • Case/Size Code:

    0805

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.35 Ω

  • Inductance-Nom (L):

    0.27 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.85 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    20

  • Rated Current-Max:

    0.25 A

  • Self Resonance Frequency:

    220 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    25 MHz

  • Tolerance:

    10%

MLF2012DR27KT000 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MLF2012DR27KT000 can be found in the TDK Corporation's application note or footprint library. It typically includes a rectangular pad with a size of around 1.2mm x 0.8mm, with a solder mask clearance of 0.1mm.
  • Thermal derating of MLF2012DR27KT000 can be handled by following the guidelines provided in the datasheet. Typically, the component's power rating decreases as the ambient temperature increases. A general rule of thumb is to derate the power by 1-2% per degree Celsius above the rated temperature.
  • The moisture sensitivity level of MLF2012DR27KT000 is typically MSL 3, which means it can withstand a maximum of 168 hours of exposure to 30°C/60% RH before soldering. However, it's recommended to follow the specific storage and handling guidelines provided by TDK Corporation to prevent moisture-related issues.
  • While MLF2012DR27KT000 is designed to be robust, it's essential to evaluate its suitability for high-vibration environments. TDK Corporation may provide additional information on vibration testing and recommended mounting techniques. It's recommended to consult with their application engineers or perform custom testing to ensure the component's reliability in such environments.
  • To ensure the reliability of MLF2012DR27KT000 in high-temperature applications, it's crucial to follow the recommended operating temperature range and derating guidelines. Additionally, consider using thermal interface materials, heat sinks, or other thermal management techniques to keep the component within its specified temperature range.

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MLF2012DR27KT000 Overview

Use the download button to access the MLF2012DR27KT000 schematic symbol, PCB footprint, and 3D model.
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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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Part Image MLF2012DR27KTD25 TDK Corporation

General Purpose Inductor, 0.27uH, 10%, 1 Element, Ferrite-Core, SMD, 0805