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MLF2012DR27MTD25 - TDK

Description: SMD / SMT Inductors (Coils), L=0.27?H, L x W x T :

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Symbol
MLF2012DR27MTD25 - TDK - PCB symbol
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PCB Footprints
MLF2012DR27MTD25 - TDK PCB footprint - Inductors Chip - Inductors Chip - MLF2012(0.85T)
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3D Models
MLF2012DR27MTD25 - TDK - 3D model - Inductors Chip - MLF2012(0.85T)
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MLF2012DR27MTD25 Details

  • Manufacturer Part Number:

    MLF2012DR27MTD25

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    7.1

  • Case/Size Code:

    0805

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.35 Ω

  • Inductance-Nom (L):

    0.27 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.85 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    20

  • Rated Current-Max:

    0.25 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    220 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    25 MHz

  • Tolerance:

    20%

MLF2012DR27MTD25 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MLF2012DR27MTD25 can be found in the TDK Corporation's recommended footprint document or in the IPC-7351 standard. It's essential to follow the recommended land pattern to ensure reliable soldering and to prevent defects.
  • Handle the MLF2012DR27MTD25 component by the edges or the tape reel to prevent damage. Avoid touching the component's terminals or the body to prevent electrostatic discharge (ESD) damage. Use ESD-safe materials and follow proper ESD handling procedures.
  • The maximum reflow temperature for MLF2012DR27MTD25 is 260°C, as specified in the datasheet. Exceeding this temperature can cause damage to the component or affect its reliability.
  • The MLF2012DR27MTD25 component is designed to withstand certain levels of vibration. However, it's essential to evaluate the component's performance in your specific application and environment. Consult with TDK Corporation or a qualified engineer to determine the component's suitability for your use case.
  • Store the MLF2012DR27MTD25 component in its original packaging, away from direct sunlight, moisture, and extreme temperatures. Follow the storage conditions recommended by TDK Corporation or the component's datasheet to maintain its shelf life and performance.

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MLF2012DR27MTD25 Overview

Use the download button to access the MLF2012DR27MTD25 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MLF20, or try a keyword search, such as Fixed Inductors

About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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