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MLF2012DR33JTD25 - TDK

Description: SMD / SMT Inductors (Coils), L=0.33?H, L x W x T :

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Symbol
MLF2012DR33JTD25 - TDK - PCB symbol
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PCB Footprints
MLF2012DR33JTD25 - TDK PCB footprint - Inductors Chip - Inductors Chip - SIZE CODE 2012_a
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3D Models
MLF2012DR33JTD25 - TDK - 3D model - Inductors Chip - SIZE CODE 2012_a
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MLF2012DR33JTD25 Details

  • Manufacturer Part Number:

    MLF2012DR33JTD25

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    7.1

  • Case/Size Code:

    0805

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.4 Ω

  • Inductance-Nom (L):

    0.33 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.85 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    20

  • Rated Current-Max:

    0.25 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    200 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    25 MHz

  • Tolerance:

    5%

MLF2012DR33JTD25 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MLF2012DR33JTD25 can be found in the TDK Corporation's application note or on their website. It typically includes a rectangular pad with a size of 1.2mm x 0.8mm and a solder mask clearance of 0.1mm.
  • Handle the component by the edges or the tape reel to prevent damage. Avoid touching the component's terminals or body to prevent electrostatic discharge (ESD) damage. Use an ESD wrist strap or mat if necessary.
  • The maximum reflow temperature for MLF2012DR33JTD25 is 260°C, with a peak temperature of 240°C for a maximum of 20 seconds. Refer to the TDK Corporation's reflow profile guidelines for more information.
  • Yes, MLF2012DR33JTD25 is designed to withstand high-vibration environments. However, it's recommended to follow the TDK Corporation's guidelines for vibration testing and to ensure that the component is properly secured to the PCB to prevent mechanical stress.
  • Store MLF2012DR33JTD25 components in a dry, cool place away from direct sunlight and moisture. The recommended storage conditions are a temperature range of 5°C to 30°C and a humidity level of 60% or less.

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MLF2012DR33JTD25 Overview

Use the download button to access the MLF2012DR33JTD25 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MLF20, or try a keyword search, such as Fixed Inductors

About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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